SBOS275G June   2003  – December 2015 VCA810

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 High Grade DC Characteristics: VS = ±5 V (VCA810AID)
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input and Output Range
      2. 8.3.2 Overdrive Recovery
      3. 8.3.3 Output Offset Error
      4. 8.3.4 Offset Adjustment
      5. 8.3.5 Gain Control
      6. 8.3.6 Gain Control and Teeple Point
      7. 8.3.7 Noise Performance
      8. 8.3.8 Input and ESD Protection
    4. 8.4 Device Functional Modes
  9. 9 Applications and Implementation
    1. 9.1 Application Information
      1. 9.1.1 VCA810 Operation
      2. 9.1.2 Range-Finding TGC Amplifier
      3. 9.1.3 Wide-Range AGC Amplifier
      4. 9.1.4 Stabilized Wein-Bridge Oscillator
      5. 9.1.5 Low-Drift Wideband Log Amplifier
      6. 9.1.6 Voltage-Controlled Low-Pass Filter
      7. 9.1.7 Tunable Equalizer
      8. 9.1.8 Voltage-Controlled Band-Pass filter
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Analysis
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Demonstration Boards
        2. 12.1.1.2 Macromodels and Applications Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support

12.1.1.1 Demonstration Boards

A printed circuit board (PCB) is available to assist in the initial evaluation of circuit performance using the VCA810. This evaluation board (EVM) is available free, as an unpopulated PCB delivered with descriptive documentation. The summary information for this board is shown in the DEM-VCA-SO-1A user's guide.

12.1.1.2 Macromodels and Applications Support

Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. This is particularly true for video and RF amplifier circuits where parasitic capacitance and inductance can play a major role in circuit performance. A SPICE model for the VCA810 is available through the TI web page. The applications group is also available for design assistance. The models available from TI predict typical small-signal AC performance, transient steps, DC performance, and noise under a wide variety of operating conditions. The models include the noise terms found in the electrical specifications of the relevant product data sheet.

12.2 Documentation Support

12.2.1 Related Documentation

Unity-Gain Stable, Low-Noise, Voltage-Feedback Operational Amplifier, SBOS303

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.