JAJSQ97 データシート

JAJSQ97J may 2009 – january 2021 XIO2001

PRODUCTION DATA

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）

PNP|128
- MPQF060E
ZWS|169
- MPBGAK4B
ZAJ|144
- MPBG878A

サーマルパッド・メカニカル・データ

PNP|128
- PPTD154D

発注情報

6.4 Thermal Information⁽¹⁾

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
PNP
θ_JA	Junction-to-free-air thermal resistance	Low-K JEDEC test board, 1s (single signal layer), no air flow		50.8		°C/W
θ_JA	Junction-to-free-air thermal resistance	High-K JEDEC test board, 2s2p (double signal layer, double buried power plane), no air flow		24.9		°C/W
θ_JC	Junction-to-case thermal resistance	Cu cold plate measurement process		18.9		°C/W
θ_JB	Junction-to-board thermal resistance	EIA/JESD 51-8		14.6		°C/W
ψ_JT	Junction-to-top of package	EIA/JESD 51-2		0.26		°C/W
ψ_JB	Junction-to-board	EIA/JESD 51-6		7.93		°C/W
T_A	Operating ambient temperature range	XIO2001PNP	0		70	°C
T_A	Operating ambient temperature range	XIO2001IPNP	–40		85	°C
T_J	Virtual junction temperature	XIO2001PNP	0		105	°C
T_J	Virtual junction temperature	XIO2001IPNP	–40		105	°C
ZAJ
θ_JA	Junction-to-free-air thermal resistance	Low-K JEDEC test board, 1s (single signal layer), no air flow		82		°C/W
θ_JA	Junction-to-free-air thermal resistance	High-K JEDEC test board, 2s2p (double signal layer, double buried power plane), no air flow		58.8		°C/W
θ_JC	Junction-to-case thermal resistance	Cu cold plate measurement process		19		°C/W
θ_JB	Junction-to-board thermal resistance	EIA/JESD 51-8		32		°C/W
ψ_JT	Junction-to-top of package	EIA/JESD 51-2		0.5		°C/W
ψ_JB	Junction-to-board	EIA/JESD 51-6		30		°C/W
T_A	Operating ambient temperature range	XIO2001ZAJ	0		70	°C
T_A	Operating ambient temperature range	XIO2001IZAJ	–40		85	°C
T_J	Virtual junction temperature	XIO2001ZAJ	0		105	°C
T_J	Virtual junction temperature	XIO2001IZAJ	–40		105	°C
ZWS
θ_JA	Junction-to-free-air thermal resistance	High-K JEDEC test board, 2s2p (double signal layer, double buried power plane), no air flow		36.2		°C/W
θ_JC	Junction-to-case thermal resistance	Cu cold plate measurement process		18.3		°C/W
θ_JB	Junction-to-board thermal resistance	EIA/JESD 51-8		20.3		°C/W
ψ_JT	Junction-to-top of package	EIA/JESD 51-2		0.4		°C/W
ψ_JB	Junction-to-board	EIA/JESD 51-6		20.1		°C/W
T_A	Operating ambient temperature range	XIO2001ZWS	0		70	°C
T_A	Operating ambient temperature range	XIO2001IZWS	–40		85	°C
T_J	Virtual junction temperature	XIO2001ZWS	0		105	°C
T_J	Virtual junction temperature	XIO2001IZWS	–40		105	°C

(1) For more details, refer to TI application note IC Package Thermal Metrics (SPRA953).

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）

サーマルパッド・メカニカル・データ

発注情報

6.4 Thermal Information(1)

6.4 Thermal Information⁽¹⁾