10.1.1 PC Board Guidelines
The following guidelines must be followed when designing the PC board for the TPS2490:
- Place the TPS2490 close to the board's input connector to minimize trace inductance from the connector to the FET.
- Note that special care must be taken when placing the bypass capacitor for the VCC pin. During hot shorts, there is a very large dV/dt on input voltage after the MOSFET turns off. If the bypass capacitor is placed right next to the pin and the trace from Rsns to the pin is long, an LC filter is formed. As a result, a large differential voltage can develop between VCC and SENSE. To avoid this, place the bypass capacitor close to Rsns instead of the VCC pin.
- The sense resistor (RS) must be close to the TPS2490, and connected to it using Kelvin techniques.
- The high current path from the board's input to the load (via Q1), and the return path, must be parallel and close to each other to minimize loop inductance.
- The ground connection for the various components around the TPS2490 must be connected directly to each other and to the TPS2490's GND pin, and then connected to the system ground at one point. Do not connect the various component grounds to each other through the high current ground line.
- Provide adequate heat sinking for the series pass device (Q1) to help reduce stresses during turnon and turnoff.
- The board's edge connector can be designed to shut off the TPS2490 as the board is removed, before the supply voltage is disconnected from the TPS2490. A shorter edge connector pin can be used for the EN signal going to the TPS2490. In this case, when the board is inserted into the edge connector, the system voltage is applied to the TPS2490's VCC pin before the EN voltage is taken high.