Using the thermal metrics Ψ_JT and Ψ_JB, as shown in the Thermal Information table, the junction temperature can be estimated with corresponding formulas (given in Equation 8). For backward compatibility, an older θ_JC,Top parameter is listed as well.

Equation 8.

where:

• P_D is the power dissipation shown by Equation 6
• T_T is the temperature at the center-top of the device package
• T_B is the PCB temperature measured 1-mm away from the device package on the PCB surface (as Figure 7-11 shows)

For more information about measuring T_T and T_B, see the Using New Thermal Metrics application note, available for download at www.ti.com.

As Figure 7-10 shows, the new thermal metrics (Ψ_JT and Ψ_JB) have very little dependency on board size. That is, using Ψ_JT or Ψ_JB with Equation 8 is a good way to estimate T_J by simply measuring T_T or T_B, regardless of the application board size.

Figure 7-10 Ψ_JT and Ψ_JB vs Board Size

For a more detailed discussion of why TI does not recommend using θ_JC(top) to determine thermal characteristics, see the Using New Thermal Metrics application note, available for download at www.ti.com. For further information, see the Semiconductor and IC Package Thermal Metrics application note, also available on the TI website. Figure 7-11 shows the measuring points for DRB, DRV, and DCQ packages.

A. Power dissipation can limit operating range. Check the Thermal Information table.

Figure 7-11 Measuring Points for T_T and T_B