JAJSAY9L
February 2009 – May 2018
LM26420
PRODUCTION DATA.
1
特長
2
アプリケーション
3
概要
Device Images
LM26420デュアル降圧DC/DCコンバータ
LM26420の効率(最高93%)
4
改訂履歴
5
Pin Configuration and Functions
Pin Functions: 16-Pin WQFN
Pin Functions 20-Pin HTSSOP
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings (LM26420X/Y)
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics Per Buck
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Soft Start
7.3.2
Power Good
7.3.3
Precision Enable
7.4
Device Functional Modes
7.4.1
Output Overvoltage Protection
7.4.2
Undervoltage Lockout
7.4.3
Current Limit
7.4.4
Thermal Shutdown
8
Application and Implementation
8.1
Application Information
8.1.1
Programming Output Voltage
8.1.2
VINC Filtering Components
8.1.3
Using Precision Enable and Power Good
8.1.4
Overcurrent Protection
8.2
Typical Applications
8.2.1
LM26420X 2.2-MHz, 0.8-V Typical High-Efficiency Application Circuit
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.2.1
Custom Design With WEBENCH® Tools
8.2.1.2.2
Inductor Selection
8.2.1.2.3
Input Capacitor Selection
8.2.1.2.4
Output Capacitor
8.2.1.2.5
Calculating Efficiency and Junction Temperature
8.2.1.3
Application Curves
8.2.2
LM26420X 2.2-MHz, 1.8-V Typical High-Efficiency Application Circuit
8.2.2.1
Design Requirements
8.2.2.2
Detailed Design Procedure
8.2.2.3
Application Curves
8.2.3
LM26420X 2.2-MHz, 2.5-V Typical High-Efficiency Application Circuit
8.2.3.1
Design Requirements
8.2.3.2
Detailed Design Procedure
8.2.3.3
Application Curves
8.2.4
LM26420Y 550 kHz, 0.8-V Typical High-Efficiency Application Circuit
8.2.4.1
Design Requirements
8.2.4.2
Detailed Design Procedure
8.2.4.3
Application Curves
8.2.5
LM26420Y 550-kHz, 1.8-V Typical High-Efficiency Application Circuit
8.2.5.1
Design Requirements
8.2.5.2
Detailed Design Procedure
8.2.5.3
Application Curves
8.2.6
LM26420Y 550-kHz, 2.5-V Typical High-Efficiency Application Circuit
8.2.6.1
Design Requirements
8.2.6.2
Detailed Design Procedure
8.2.6.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
10.3
Thermal Considerations
10.3.1
Method 1: Silicon Junction Temperature Determination
10.3.2
Thermal Shutdown Temperature Determination
11
デバイスおよびドキュメントのサポート
11.1
デバイス・サポート
11.1.1
デベロッパー・ネットワークの製品に関する免責事項
11.1.2
WEBENCH®ツールによるカスタム設計
11.2
ドキュメントのサポート
11.2.1
関連資料
11.3
ドキュメントの更新通知を受け取る方法
11.4
コミュニティ・リソース
11.5
商標
11.6
静電気放電に関する注意事項
11.7
Glossary
12
メカニカル、パッケージ、および注文情報
8.2.2.3
Application Curves
See
Application Curves
above.