TPS22975製品ファミリは、TPS22975とTPS22975Nの2つのデバイスで構成されます。いずれのデバイスもシングル・チャネルの負荷スイッチで、立ち上がり時間を構成して突入電流を最小化できます。このデバイスにはNチャネルMOSFETが搭載され、0.6V~ 5.7Vの入力電圧範囲で動作し、最大で6Aの連続電流をサポートできます。スイッチはオン/オフ入力(ON)により制御され、低電圧の制御信号と直接接続が可能です。TPS22975には、スイッチがオフになったときにクイック出力放電を行うため、230Ωのオンチップ負荷抵抗をオプションで搭載できます。
TPS22975は小型で省スペースの2mm×2mm 8ピンのSONパッケージ(DSG)で供給され、大きな消費電力に対応できるようサーマル・パッドが搭載されています。このデバイスは、自由通気で-40℃~+105℃の温度範囲で動作するよう規定されています。
型番 | パッケージ | 本体サイズ(公称) |
---|---|---|
TPS22975 TPS22975N |
WSON (8) | 2.00mm×2.00mm |
Changes from A Revision (June 2016) to B Revision
Changes from * Revision (May 2016) to A Revision
DEVICE | RON AT VIN = VBIAS = 5 V (TYPICAL) | QUICK-OUTPUT DISCHARGE | MAXIMUM OUTPUT CURRENT | ENABLE |
---|---|---|---|---|
TPS22975 | 16 mΩ | Yes | 6 A | Active high |
TPS22975N | 16 mΩ | No | 6 A | Active high |
PIN | I/O | DESCRIPTION | |
---|---|---|---|
NO. | NAME | ||
1 | VIN | I | Switch input. Input bypass capacitor recommended for minimizing VIN dip. Must be connected to Pin 1 and Pin 2. See the Application and Implementation section for more information |
2 | |||
3 | ON | I | Active high switch control input. Do not leave floating |
4 | VBIAS | I | Bias voltage. Power supply to the device. Recommended voltage range for this pin is 2.5 V to 5.7 V. See the Application and Implementation section for more information |
5 | GND | — | Device ground |
6 | CT | O | Switch slew rate control. Can be left floating. See the Adjustable Rise Time section under Feature Description for more information |
7 | VOUT | O | Switch output |
8 | |||
— | Thermal Pad | — | Thermal pad (exposed center pad) to alleviate thermal stress. Tie to GND. See the Layout Example section for layout guidelines |
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
VIN | Input voltage | –0.3 | 6 | V | |
VOUT | Output voltage | –0.3 | 6 | V | |
VBIAS | Bias voltage | –0.3 | 6 | V | |
VON | On voltage | –0.3 | 6 | V | |
IMAX | Maximum continuous switch current | 6 | A | ||
IPLS | Maximum pulsed switch current, pulse < 300 µs, 2% duty cycle | 8 | A | ||
TJ | Maximum junction temperature | 125 | °C | ||
Tstg | Storage temperature | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1000 |
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
VIN | Input voltage | 0.6 | VBIAS | V | |
VBIAS | Bias voltage | 2.5 | 5.7 | V | |
VON | ON voltage | 0 | 5.7 | V | |
VOUT | Output voltage | VIN | V | ||
VIH | High-level input voltage, ON | VBIAS = 2.5 V to 5 V, TA< 85°C | 1.05 | 5.7 | V |
VBIAS = 2.5 V to 5 V, TA< 105°C | 1.1 | 5.7 | |||
VBIAS = 5 V to 5.7 V, TA< 105°C | 1.2 | 5.7 | |||
VIL | Low-level input voltage, ON | VBIAS = 2.5 V to 5.7 V | 0 | 0.5 | V |
CIN | Input capacitor | 1(1) | µF | ||
TA | Operating free-air temperature(1)(2) | –40 | 105 | °C |
THERMAL METRIC(1) | TPS22975 | UNIT | |
---|---|---|---|
DSG (WSON) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 74.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 81 | °C/W |
RθJB | Junction-to-board thermal resistance | 44.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 3.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 45.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 16.4 | °C/W |
PARAMETER | TEST CONDITIONS | TA | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|---|
POWER SUPPLIES AND CURRENTS | ||||||||
IQ, VBIAS | VBIAS quiescent current | IOUT = 0 A, VIN = VON = 5 V |
–40°C to +105°C | 37 | 45 | µA | ||
ISD, VBIAS | VBIAS shutdown current | VON = VOUT = 0 V | –40°C to +105°C | 2.3 | µA | |||
ISD, VIN | VIN off-state supply current | VON = VOUT = 0 V | VIN = 5 V | –40°C to +85°C | 0.005 | 5 | µA | |
–40°C to +105°C | 10 | |||||||
VIN = 3.3 V | –40°C to +85°C | 0.002 | 1.5 | |||||
–40°C to +105°C | 3.5 | |||||||
VIN = 1.8 V | –40°C to +85°C | 0.002 | 1 | |||||
–40°C to +105°C | 2 | |||||||
VIN = 0.6 V | –40°C to +85°C | 0.001 | 0.5 | |||||
–40°C to +105°C | 1 | |||||||
ION | On-pin input leakage current | VON = 5.5 V | –40°C to +105°C | 0.1 | µA | |||
RESISTANCE CHARACTERISTICS | ||||||||
RON | On-resistance | IOUT = –200 mA | VIN = 5 V | 25°C | 16 | 19 | mΩ | |
–40°C to +85°C | 23 | |||||||
–40°C to +105°C | 25 | |||||||
VIN = 3.3 V | 25°C | 16 | 19 | |||||
–40°C to +85°C | 23 | |||||||
–40°C to +105°C | 25 | |||||||
VIN = 1.8 V | 25°C | 16 | 19 | |||||
–40°C to +85°C | 23 | |||||||
–40°C to +105°C | 25 | |||||||
VIN = 1.5 V | 25°C | 16 | 19 | |||||
–40°C to +85°C | 23 | |||||||
–40°C to +105°C | 25 | |||||||
VIN = 1.05 V | 25°C | 16 | 19 | |||||
–40°C to +85°C | 23 | |||||||
–40°C to +105°C | 25 | |||||||
VIN = 0.6 V | 25°C | 16 | 19 | |||||
–40°C to +85°C | 23 | |||||||
–40°C to +105°C | 25 | |||||||
VON, HYS | On-pin hysteresis | VIN = 5 V | 25°C | 120 | mV | |||
RPD (1) | Output pulldown resistance | VIN = 5 V, VON = 0 V | –40°C to +105°C | 230 | 300 | Ω | ||
TSD | Thermal shutdown | Junction temperature rising | 160 | °C | ||||
TSD, HYS | Thermal shutdown hysteresis | Junction temperature falling | 20 | °C |
PARAMETER | TEST CONDITIONS | TA | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|---|
POWER SUPPLIES AND CURRENTS | ||||||||
IQ, VBIAS | VBIAS quiescent current | IOUT = 0 mA, VIN = VON = 2.5 V |
–40°C to +105°C | 14 | 20 | µA | ||
ISD, VBIAS | VBIAS shutdown current | VON = VOUT = 0 V | –40°C to +105°C | 1 | µA | |||
ISD, VIN | VIN off-state supply current | VON = VOUT = 0 V | VIN = 2.5 V | –40°C to +85°C | 0.005 | 1.3 | µA | |
–40°C to +105°C | 2.6 | |||||||
VIN = 1.8 V | –40°C to +85°C | 0.002 | 1 | |||||
–40°C to +105°C | 2 | |||||||
VIN = 1.05 V | –40°C to +85°C | 0.002 | 0.8 | |||||
–40°C to +105°C | 1.5 | |||||||
VIN = 0.6 V | –40°C to +85°C | 0.001 | 0.5 | |||||
–40°C to +105°C | 1 | |||||||
ION | On-pin input leakage current | VON = 5.5 V | –40°C to +105°C | 0.1 | µA | |||
RESISTANCE CHARACTERISTICS | ||||||||
RON | On-resistance | IOUT = –200 mA | VIN = 2.5 V | 25°C | 20 | 26 | mΩ | |
–40°C to +85°C | 32 | |||||||
–40°C to +105°C | 34 | |||||||
VIN = 1.8 V | 25°C | 18 | 23 | |||||
–40°C to +85°C | 29 | |||||||
–40°C to +105°C | 31 | |||||||
VIN = 1.5 V | 25°C | 18 | 22 | |||||
–40°C to +85°C | 28 | |||||||
–40°C to +105°C | 30 | |||||||
VIN = 1.2 V | 25°C | 17 | 22 | |||||
–40°C to +85°C | 27 | |||||||
–40°C to +105°C | 29 | |||||||
VIN = 0.6 V | 25°C | 17 | 21 | |||||
–40°C to +85°C | 26 | |||||||
–40°C to +105°C | 27 | |||||||
VON, HYS | On-pin hysteresis | VIN = 2.5 V | 25°C | 85 | mV | |||
RPD(1) | Output pulldown resistance | VIN = 2.5 V, VON = 0 V | –40°C to +105°C | 230 | 330 | Ω | ||
TSD | Thermal shutdown | Junction temperature rising | 160 | °C | ||||
TSD, HYS | Thermal shutdown hysteresis | Junction temperature falling | 20 | °C |
PARAMETER | TEST CONDITION | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
VIN = VBIAS = 5 V, TA = 25ºC (unless otherwise noted) | ||||||
tON | Turnon time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 1450 | µs | ||
tOFF | Turnoff time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 2 | |||
tR | VOUT rise time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 1750 | |||
tF | VOUT fall time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 2 | |||
tD | ON delay time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 600 | |||
VIN = 0.6 V, VBIAS = 5 V, TA = 25ºC (unless otherwise noted) | ||||||
tON | Turnon time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 620 | µs | ||
tOFF | Turnoff time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 2 | |||
tR | VOUT rise time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 280 | |||
tF | VOUT fall time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 2 | |||
tD | ON delay time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 485 | |||
VIN = VBIAS = 2.5 V, TA = 25ºC (unless otherwise noted) | ||||||
tON | Turnon time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 2180 | µs | ||
tOFF | Turnoff time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 2 | |||
tR | VOUT rise time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 2150 | |||
tF | VOUT fall time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 2 | |||
tD | ON delay time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 1120 | |||
VIN = 0.6 V, VBIAS = 2.5 V, TA = 25ºC (unless otherwise noted) | ||||||
tON | Turnon time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 1315 | µs | ||
tOFF | Turnoff time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 3 | |||
tR | VOUT rise time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 650 | |||
tF | VOUT fall time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 2 | |||
tD | ON delay time | RL = 10 Ω, CL = 0.1 µF, CIN = 1 µF, CT = 1000 pF, VON = 5 V | 975 |
VIN = VBIAS | VON = 5 V | VOUT = 0 V |
VIN = VBIAS | VON = 0 V | VOUT = 0 V |
VBIAS = 5 V | IOUT = –200 mA | VON = 5 V |
Note: | All three RON curves have the same values; therefore, only one line is visible. |
VBIAS = 5 V | IOUT = –200 mA | VON = 5 V |
TA = 25°C | IOUT = –200 mA | VON = 5 V |
VBIAS = 5 V | VON = 5 V | VOUT = 0 V |
VBIAS = 5 V | VON = 0 V | VOUT = 0 V |
VBIAS = 2.5 V | IOUT = –200 mA | VON = 5 V |
VBIAS = 2.5 V | IOUT = –200 mA | VON = 5 V |
VIN = 2.5 V | VON = 0 V | |
VBIAS = 2.5 V | ||
VBIAS = 2.5 V | ||
VBIAS = 2.5 V | ||
VBIAS = 2.5 V | ||
VBIAS = 2.5 V | ||
VIN = 0.6 V | VBIAS = 2.5 V | |
VIN = 2.5 V | VBIAS = 2.5 V | |
VIN = 0.6 V | VBIAS = 2.5 V | |
VIN = 2.5 V | VBIAS = 2.5 V | |
VBIAS = 5 V | ||
VBIAS = 5 V | ||
VBIAS = 5 V | ||
VBIAS = 5 V | ||
VBIAS = 5 V | ||
VIN = 0.6 V | VBIAS = 5 V | |
VIN = 5 V | VBIAS = 5 V | |
VIN = 0.6 V | VBIAS = 5 V | |
VIN = 5 V | VBIAS = 5 V | |
The TPS22975 device is a single-channel, 6-A load switch in an 8-pin SON package. To reduce the voltage drop in high current rails, the device implements an N-channel MOSFET. The device has a configurable slew rate for applications that require a specific rise-time.
The device prevents downstream circuits from pulling high standby current from the supply by limiting the leakage current of the device when it is disabled. The integrated control logic, driver, power supply, and output discharge FET eliminates the need for any external components, which reduces solution size and bill of materials (BOM) count.
A capacitor to GND on the CT pin sets the slew rate. The voltage on the CT pin can be as high as 15 V; therefore, the minimum voltage rating for the CT capacitor must be 30 V for optimal performance. An approximate formula for the relationship between CT and slew rate when VBIAS is set to 5 V is shown in Equation 1. This equation accounts for 10% to 90% measurement on VOUT and does not apply for CT < 100 pF. Use Table 1 to determine rise times for when CT = 0 pF.
where
Rise time can be calculated by multiplying the input voltage by the slew rate. Table 1 contains rise time values measured on a typical device. Rise times shown in Table 1 are only valid for the power-up sequence where VIN and VBIAS are already in steady state condition before the ON pin is asserted high.
CT (pF) | RISE TIME (µs) 10% - 90%, CL = 0.1 µF, CIN = 1 µF, RL = 10 Ω, VBIAS = 5 V(1) | ||||||
---|---|---|---|---|---|---|---|
VIN = 5 V | VIN = 3.3 V | VIN = 1.8 V | VIN = 1.5 V | VIN = 1.2 V | VIN = 1.05 V | VIN = 0.6 V | |
0 | 140 | 105 | 75 | 65 | 60 | 55 | 40 |
220 | 520 | 360 | 215 | 185 | 160 | 140 | 95 |
470 | 970 | 660 | 385 | 330 | 275 | 240 | 155 |
1000 | 1750 | 1190 | 700 | 595 | 495 | 435 | 275 |
2200 | 3875 | 2615 | 1520 | 1290 | 1070 | 940 | 595 |
4700 | 7580 | 5110 | 2950 | 2510 | 2075 | 1830 | 1150 |
10000 | 16980 | 11485 | 6650 | 5635 | 4685 | 4110 | 2595 |
The TPS22975 includes an optional QOD feature. When the switch is disabled, an internal discharge resistance is connected between VOUT and GND to remove the remaining charge from the output. This resistance has a typical value of 230 Ω and prevents the output from floating while the switch is disabled. For best results, it is recommended that the device gets disabled before VBIAS falls below the minimum recommended voltage.
Thermal shutdown protects the part from internally or externally generated excessive temperatures. When the device temperature triggers TSD (typical 160°C), the switch is turned off. The switch automatically turns on again if the temperature of the die drops 20 degrees below the TSD threshold.
The Table 2 lists the VOUT pin states as determined by the ON pin.
ON | TPS22975 | TPS22975N |
---|---|---|
L | GND | Open |
H | VIN | VIN |