JAJSDD8C July   2017  – June 2019 TLV743P

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的なアプリケーション回路
      2.      ドロップアウト電圧と出力電流との関係
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown and Output Enable
      3. 7.3.3 Internal Foldback Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Selection
      2. 8.1.2 Dropout Voltage
      3. 8.1.3 Power Dissipation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 開発サポート
        1. 11.1.1.1 評価基板
      2. 11.1.2 デバイスの項目表記
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報

4 改訂履歴

Changes from B Revision (March 2018) to C Revision

  • Changed description of EN pin in Pin Functions tableGo
  • Deleted typical specification from VEN(HI) and VEN(LO) parameters Go
  • Added maximum specification to ILIM parameter Go
  • Added condition to 1-V Load Regulation vs IOUT and Temperature figureGo
  • Added condition to 1.8-V Load Regulation vs IOUT and Temperature figureGo
  • Added condition to 3.3-V Load Regulation vs IOUT and Temperature figure Go
  • Added condition to 1.2-V Dropout Voltage vs IOUT and Temperature figure Go
  • Added condition to 1.8-V Dropout Voltage vs IOUT and Temperature figure Go
  • Added condition to 3.3-V Dropout Voltage vs IOUT and Temperature figure Go
  • Added and Output Enable to title and changed first paragraph of Shutdown and Output Enable sectionGo
  • Added DBV package to Maximum Ambient Temperature vs Device Power Dissipation figure and text referenceGo
  • Added 「デバイスの項目表記」表に (3) をGo

Changes from A Revision (January 2018) to B Revision

  • Changed X2SONパッケージをプレビューから量産データ(アクティブ)にGo

Changes from * Revision (July 2017) to A Revision

  • Added 「特長」の一覧にX2SONパッケージをGo
  • Added 「概要」セクションにDQN (X2SON)パッケージをGo
  • Added 「製品情報」表にX2SONパッケージをGo
  • Added DQN (X2SON) package pinout drawing and pin functions table to Pin Configuration and Functions section Go
  • Deleted thermal pad from DBV pinout drawing and Pin Functions table Go
  • Changed format of I/O column contents and order of packages in Pin Functions table Go
  • Added DQN (X2SON) thermal information to Thermal Information table Go
  • Changed condition text for Figure 31Go
  • Added X2SON layout example image to Layout Examples section Go