JAJSDH5B December 2008 – July 2017 TPA6132A2
PRODUCTION DATA.
PIN | I/O/P | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
INL- | 1 | I | Inverting left input for differential signals; left input for single-ended signals |
INL+ | 2 | I | Non-inverting left input for differential signals. Connect to ground for single-ended input applications |
INR+ | 3 | I | Non-inverting right input for differential signals. Connect to ground for single-ended input applications |
INR- | 4 | I | Inverting right input for differential signals; right input for single-ended signals |
OUTR | 5 | O | Right headphone amplifier output. Connect to right terminal of headphone jack |
G0 | 6 | I | Gain select |
GAIN0 | I | ||
G1 | 7 | I | Gain select |
GAIN1 | I | ||
HPVSS | 8 | P | Charge pump output and negative power supply for output amplifiers; connect 1μF capacitor to GND |
CPN | 9 | P | Charge pump negative flying cap. Connect to negative side of 1μF capacitor between CPP and CPN |
PGND | 10 | P | Ground |
CPP | 11 | P | Charge pump positive flying cap. Connect to positive side of 1μF capacitor between CPP and CPN |
HPVDD | 12 | P | Positive power supply for headphone amplifiers. Connect to a 2.2μF capacitor. Do not connect to VDD |
EN | 13 | I | Amplifier enable. Connect to logic low to shutdown; connect to logic high to activate |
VDD | 14 | P | Positive power supply for TPA6132A2 |
SGND | 15 | P | Amplifier reference voltage. Connect to ground terminal of headphone jack |
OUTL | 16 | O | Left headphone amplifier output. Connect to left terminal of headphone jack |
Thermal Pad | – | Solder the exposed metal pad on the TPA6132A2RTE QFN package to the landing pad on the PCB. Connect the landing pad to ground or leave it electrically unconnected (floating). |