JAJSE23C August   2017  – June 2019 TPS1H000-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的なブロック図
      2.      自動再試行モードでの電流制限保護
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 DELAY Pin Configuration
        1. 7.3.2.1 Holding Mode
        2. 7.3.2.2 Latch-Off Mode
        3. 7.3.2.3 Auto-Retry Mode
      3. 7.3.3 Standalone Operation
      4. 7.3.4 Fault Truth Table
      5. 7.3.5 Full Diagnostics
        1. 7.3.5.1 Short-to-GND and Overload Detection
        2. 7.3.5.2 Open-Load Detection
          1. 7.3.5.2.1 Output On
          2. 7.3.5.2.2 Output Off
        3. 7.3.5.3 Short-to-Battery Detection
        4. 7.3.5.4 Thermal Fault Detection
          1. 7.3.5.4.1 Thermal Shutdown
          2. 7.3.5.4.2 Thermal Swing
          3. 7.3.5.4.3 Fault Report Holding
      6. 7.3.6 Full Protections
        1. 7.3.6.1 UVLO Protection
        2. 7.3.6.2 Inductive Load Switching Off Clamp
        3. 7.3.6.3 Loss-of-GND Protection
        4. 7.3.6.4 Loss-of-Power-Supply Protection
        5. 7.3.6.5 Reverse-Current Protection
        6. 7.3.6.6 MCU I/O Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Working Modes
        1. 7.4.1.1 Normal Mode
        2. 7.4.1.2 Standby Mode
        3. 7.4.1.3 Standby Mode With Diagnostics
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 コミュニティ・リソース
    3. 11.3 商標
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 Glossary
  12. 12メカニカル、パッケージ、および注文情報

7.3.4 Fault Truth Table

The DIAG_EN pin enables or disables the diagnostic functions. If multiple devices are used, but the ADC resource is limited in the microcontroller, the microcontroller can use GPIOs to set DIAG_EN high to enable the diagnostics of one device while disabling the diagnostics of the other devices by setting DIAG_EN low. In addition, the device can keep the power consumption to a minimum by setting DIAG_EN and IN low.

Table 2 applies when the DIAG_EN pin is enabled. Table 3 applies when the DIAG_EN pin is disabled.

Table 2. Fault Truth Table

CONDITION IN OUT CRITERION FAULT FAULT RECOVERY
Normal L L — H —
H H — H
Overload or short to GND H L Current limit triggered. L See Table 1.
Open load or short to battery H H IOUT < l(ol,on) L FAULT clears when IN turns low for a duration longer than tFAULT. OR FAULT clears when the open load is removed.
L(1) H VVS – VOUT < V(ol,off) L FAULT clears when IN is toggling OR FAULT clears when the open load is removed.
Thermal shutdown H — Thermal shutdown triggered L FAULT clears when IN turns low for a duration longer than tFAULT. OR FAULT clears when thermal shutdown quits.
Thermal swing H — Thermal swing triggered L FAULT clears when IN turns low for a duration longer than tFAULT. OR FAULT clears when thermal swing quits.
(1) An external pullup is required for open-load detection.

Table 3. DIAG_EN Disabled Condition

DIAG_EN IN PROTECTIONS AND DIAGNOSTICS
LOW ON Diagnostics disabled, full protections
OFF Diagnostics disabled, no protection