DATA SHEET
LMZM33603 4V～36V入力、3A降圧型、QFNパッケージのDC/DC電源モジュール
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1 特長
- 完全に統合された電源ソリューション
- 外付け部品はわずか4個
- 100mm2未満の小さなソリューション・サイズ
- 9mm×7mm×4mmのQFNパッケージ
- すべてのピンはパッケージ周辺からアクセス可能
- 2AのLMZM33602とピン互換
- 入力電圧範囲: 4V～36V
- 出力電圧範囲
- 3Aで1V～13.5V
- 2Aで1V～18V
- 最高95%の効率
- 可変スイッチング周波数(200kHz～1.2MHz)
- 外部クロックに同期可能
- パワー・グッド出力
- EN55011 Class B放射EMI標準に合致
- 動作時IC接合部温度範囲: －40℃～＋125℃
- 動作時周囲温度範囲: －40℃～＋105℃
- WEBENCH® Power Designerにより、LMZM33603を使用するカスタム設計を作成
3 概要
LMZM33603パワー・モジュールは、3Aの降圧型DC/DCコンバータをパワーMOSFET、シールド付きインダクタ、およびパッシブ部品とともに低プロファイルのパッケージに実装した、使いやすい集積電源ソリューションです。わずか4個の外付け部品で電源ソリューションを構築でき、設計プロセスにおいてループ補償や磁気部品の選択も不要になります。
9mm×7mm×4mm、18ピンのQFNパッケージは、プリント基板に簡単にハンダ付けでき、コンパクトで薄型のポイント・オブ・ロード設計が可能です。LMZM33603は、パワー・グッド、プログラム可能なUVLO、プリバイアスのスタートアップ、過電流および過熱保護などの完全な機能セットを備え、広範なアプリケーションの電源として非常に優れたデバイスです。
製品情報
| デバイス番号 | パッケージ | 本体サイズ（公称） |
|---|---|---|
| LMZM33603 | QFN (18) | 9.00mm×7.00mm |
安全動作領域
4 改訂履歴
Changes from B Revision (February 2018) to C Revision
- Added WEBENCH用のリンクGo
- Changed the MAX output current to 3 A in the Recommended Operating Conditions tableGo
- Added EMI sub-section Go
Changes from A Revision (February 2018) to B Revision
- 量産データのデータシートの初版Go
Changes from * Revision (September 2017) to A Revision
- Added 新しい「アプリケーション」: 反転出力アプリケーション、編集上の細かい修正Go
- Added sentence re: inverting buck-boost topology to Application InformationGo
5 Pin Configuration and Functions
RLR Package
18-Pin QFN
Top View
Pin Functions
| PIN | TYPE | DESCRIPTION | |
|---|---|---|---|
| NO. | NAME | ||
| 1 | AGND | G | Analog ground. Zero voltage reference for internal references and logic. Do not connect this pin to PGND; the connection is made internal to the device. See the Layout section of the datasheet for a recommended layout. |
| 2 | EN/SYNC | I | EN - Enable input to regulator. High = On, Low = Off. Can be connected to VIN. Do not float. This pin can be used to set the input under voltage lockout with two resistors. See the Programmable Undervoltage Lockout (UVLO) section.
SYNC - The internal oscillator can be synchronized to an external clock via AC-coupling. See the Synchronization (SYNC) section for details. |
| 3 | RT | I | An external timing resistor connected between this pin and AGND adjusts the switching frequency of the device. If left open, the default switching frequency is 400 kHz. |
| 4 | VIN | I | Input supply voltage. Connect external input capacitors between this pin and PGND. |
| 5, 14, 15, 18 | PGND | G | Power ground. This is the return current path for the power stage of the device. Connect pin 5 to the input source, the load, and to the bypass capacitors associated with VIN and VOUT using power ground planes on the PCB. Pins 14 and 15 are not connected to PGND internal to the device and must be connected to PGND at pad 18. Connect pad 18 to the power ground planes using multiple vias for good thermal performance. See the Layout section of the datasheet for a recommended layout. |
| 6, 7, 8 | VOUT | O | Output voltage. These pins are connected to the internal output inductor. Connect these pins to the output load and connect external bypass capacitors between these pins and PGND. |
| 9, 10, 11 | SW | O | Switch node. Connect these pins to a small copper island under the device for thermal relief. Do not place any external component on these pins or tie them to a pin of another function. |
| 12, 13 | DNC | — | Do not connect. Each pin must be soldered to an isolated pad. These pins connect to internal circuitry. Do not connect these pins to one another, AGND, PGND, or any other voltage. |
| 16 | FB | I | Feedback input. Connect the center point of the feedback resistor divider to this pin. Connect the upper resistor (RFBT) of the feedback divider to VOUT at the desired point of regulation. Connect the lower resistor (RFBB) of the feedback divider to AGND. |
| 17 | PGOOD | O | Open drain output for power-good flag. Use a 10-kΩ to 100-kΩ pullup resistor to logic rail or other DC voltage no higher than 12 V. |
6.1 Absolute Maximum Ratings
Over operating ambient temperature range (unless otherwise noted)(1)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Input voltage | VIN | –0.3 | 42 | V |
| EN/SYNC | –5.5 | VIN + 0.3 | V | |
| PGOOD | –0.3 | 15 | V | |
| FB, RT | –0.3 | 4.5 | V | |
| Output voltage | SW | –1 | VIN + 0.3 | V |
| SW (< 10-ns transients) | –5 | 42 | V | |
| VOUT | –0.3 | VIN | V | |
| Sink current | PGOOD | 3 | mA | |
| Mechanical shock | Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted | 500 | G | |
| Mechanical vibration | Mil-STD-883D, Method 2007.2, 20 to 2000 Hz | 20 | G | |
| Operating IC junction temperature, TJ(2) | –40 | 125 | °C | |
| Operating ambient temperature, TA(2) | –40 | 105 | °C | |
| Storage temperature, Tstg | –40 | 150 | °C | |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the module is never exceeded.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2500 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±750 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
