JAJSFG3C may   2018  – may 2023 ADC12DL3200

PRODUCTION DATA  

  1.   1
  2. 1特長
  3. 2アプリケーション
  4. 3概要
  5. 4Revision History
  6. 5Pin Configuration and Functions
  7. 6Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DC Specifications
    6. 6.6  Electrical Characteristics: Power Consumption
    7. 6.7  Electrical Characteristics: AC Specifications (Dual-Channel Mode)
    8. 6.8  Electrical Characteristics: AC Specifications (Single-Channel Mode)
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  8. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
        1. 7.3.1.1 Analog Input Protection
        2. 7.3.1.2 Full-Scale Voltage (VFS) Adjustment
        3. 7.3.1.3 Analog Input Offset Adjust
      2. 7.3.2 ADC Core
        1. 7.3.2.1 ADC Theory of Operation
        2. 7.3.2.2 ADC Core Calibration
        3. 7.3.2.3 ADC Overrange Detection
        4. 7.3.2.4 Code Error Rate (CER)
        5. 7.3.2.5 Internal Dither
      3. 7.3.3 Timestamp
      4. 7.3.4 Clocking
        1. 7.3.4.1 Noiseless Aperture Delay Adjustment (tAD Adjust)
        2. 7.3.4.2 Aperture Delay Ramp Control (TAD_RAMP)
        3. 7.3.4.3 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          1. 7.3.4.3.1 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
          2. 7.3.4.3.2 Automatic SYSREF Calibration
      5. 7.3.5 LVDS Digital Interface
        1. 7.3.5.1 Multi-Device Synchronization and Deterministic Latency Using Strobes
          1. 7.3.5.1.1 Dedicated Strobe Pins
          2. 7.3.5.1.2 Reduced Width Interface With Dedicated Strobe Pins
          3. 7.3.5.1.3 LSB Replacement With a Strobe
          4. 7.3.5.1.4 Strobe Over All Data Pairs
      6. 7.3.6 Alarm Monitoring
        1. 7.3.6.1 Clock Upset Detection
      7. 7.3.7 Temperature Monitoring Diode
      8. 7.3.8 Analog Reference Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Dual-Channel Mode (Non-DES Mode)
      2. 7.4.2 Internal Dither Modes
      3. 7.4.3 Single-Channel Mode (DES Mode)
      4. 7.4.4 LVDS Output Driver Modes
      5. 7.4.5 LVDS Output Modes
        1. 7.4.5.1 Staggered Output Mode
        2. 7.4.5.2 Aligned Output Mode
        3. 7.4.5.3 Reducing the Number of Strobes
        4. 7.4.5.4 Reducing the Number of Data Clocks
        5. 7.4.5.5 Scrambling
        6. 7.4.5.6 Digital Interface Test Patterns and LVSD SYNC Functionality
          1. 7.4.5.6.1 Active Pattern
          2. 7.4.5.6.2 Synchronization Pattern
          3. 7.4.5.6.3 User-Defined Test Pattern
      6. 7.4.6 Power-Down Modes
      7. 7.4.7 Calibration Modes and Trimming
        1. 7.4.7.1 Foreground Calibration Mode
        2. 7.4.7.2 Background Calibration Mode
        3. 7.4.7.3 Low-Power Background Calibration (LPBG) Mode
      8. 7.4.8 Offset Calibration
      9. 7.4.9 Trimming
    5. 7.5 Programming
      1. 7.5.1 Using the Serial Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 78
        6. 7.5.1.6 Streaming Mode
        7. 7.5.1.7 80
    6. 7.6 Register Maps
      1. 7.6.1 SPI_REGISTER_MAP Registers
  9.   Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Wideband RF Sampling Receiver
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Input Signal Path
          2. 8.2.1.1.2 Clocking
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Calculating Values of AC-Coupling Capacitors
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Reconfigurable Dual-Channel, 2.5-GSPS or Single-Channel, 5.0-GSPS Oscilloscope
        1. 8.2.2.1 Design Requirements
          1. 8.2.2.1.1 Input Signal Path
          2. 8.2.2.1.2 Clocking
          3. 8.2.2.1.3 The ADC12DL3200
        2. 8.2.2.2 Application Curves
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Power Sequencing
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 商標
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  11. 9Mechanical, Packaging, and Orderable Information
SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)

The SYSREF windowing block is used to first detect the position of SYSREF relative to the CLK± rising edge and then to select a desired SYSREF sampling instance, which is a delay version of CLK±, to maximize setup and hold timing margins. In many cases a single SYSREF sampling position (SYSREF_SEL) is sufficient to meet timing for all systems (device-to-device variation) and conditions (temperature and voltage variations). However, this feature can also be used by the system to expand the timing window by tracking the movement of SYSREF as operating conditions change or to remove system-to-system variation at production test by finding a unique optimal value at nominal conditions for each system.

This section describes proper usage of the SYSREF windowing block. First, apply the device clock and SYSREF to the device. The location of SYSREF relative to the device clock cycle is determined and stored in the SYSREF_POS bits of the SYSREF capture position register. Each bit of SYSREF_POS represents a potential SYSREF sampling position. If a bit in SYSREF_POS is set to 1, then the corresponding SYSREF sampling position has a potential setup or hold violation. Upon determining the valid SYSREF sampling positions (the positions of SYSREF_POS that are set to 0) the desired sampling position can be chosen by setting SYSREF_SEL in clock control register 0 to the value corresponding to that SYSREF_POS position. In general, the middle sampling position between two setup and hold instances is chosen. Ideally, SYSREF_POS and SYSREF_SEL are performed at the nominal operating conditions of the system (temperature and supply voltage) to provide maximum margin for operating condition variations. This process can be performed at final test and the optimal SYSREF_SEL setting can be stored for use at every system power up. Further, SYSREF_POS can be used to characterize the skew between CLK± and SYSREF± over operating conditions for a system by sweeping the system temperature and supply voltages. For systems that have large variations in CLK± to SYSREF± skew, this characterization can be used to track the optimal SYSREF sampling position as system operating conditions change. In general, a single value can be found that meets timing over all conditions for well-matched systems, such as those where CLK± and SYSREF± come from a single clocking device.

Note:

SYSREF_SEL must be set to 0 when using automatic SYSREF calibration; see the Section 7.3.4.3.2 section.

The step size between each SYSREF_POS sampling position can be adjusted using SYSREF_ZOOM. When SYSREF_ZOOM is set to 0, the delay steps are coarser. When SYSREF_ZOOM is set to 1, the delay steps are finer. See the Section 6.10 table for delay step sizes when SYSREF_ZOOM is enabled and disabled. In general, SYSREF_ZOOM is recommended to always be used (SYSREF_ZOOM = 1) unless a transition region (defined by 1's in SYSREF_POS) is not observed, which can be the case for low clock rates. Bits 0 and 23 of SYSREF_POS are always be set to 1 because there is insufficient information to determine if these settings are close to a timing violation, although the actual valid window can extend beyond these sampling positions. The value programmed into SYSREF_SEL is the decimal number representing the desired bit location in SYSREF_POS. Table 7-5 lists some example SYSREF_POS readings and the optimal SYSREF_SEL settings. Although 24 sampling positions are provided by the SYSREF_POS status register, SYSREF_SEL only allows selection of the first 16 sampling positions, corresponding to SYSREF_POS bits 0 to 15. The additional SYSREF_POS status bits are intended only to provide additional knowledge of the SYSREF valid window. In general, lower values of SYSREF_SEL are selected because of delay variation over supply voltage; however, in the fourth example a value of 15 provides additional margin and can be selected instead.

Table 7-5 Examples of SYSREF_POS Readings and SYSREF_SEL Selections
SYSREF_POS[23:0]OPTIMAL SYSREF_SEL SETTING
0x02E[7:0]
(Largest Delay)
0x02D[7:0](1)0x02C[7:0](1)
(Smallest Delay)
b10000000b01100000b000110018 or 9
b10011000b00000000b0011000112
b10000000b01100000b000000016 or 7
b10000000b00000011b000000014 or 15
b10001100b01100011b000110016
Red coloration indicates the bits that are selected, as given in the last column of this table.