JAJSFM3E February   2015  – June 2018 LMH1218

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      SPI概略回路図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Descriptions – SPI Mode/ Mode_SEL = 1 kΩ to VDD
    2.     Pin Descriptions – SMBUS Mode/ MODE_SEL = 1 kΩ to GND
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Recommended SMBus Interface AC Timing Specifications
    7. 7.7 Serial Parallel Interface (SPI) Bus Interface AC Timing Specifications
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Loss of Signal Detector
      2. 8.3.2 Continuous Time Linear Equalizer (CTLE)
      3. 8.3.3 2:1 Multiplexer
      4. 8.3.4 Clock and Data Recovery
      5. 8.3.5 Eye Opening Monitor (EOM)
      6. 8.3.6 Fast EOM
        1. 8.3.6.1 SMBus Fast EOM Operation
        2. 8.3.6.2 SPI Fast EOM Operation
      7. 8.3.7 LMH1218 Device Configuration
        1. 8.3.7.1 MODE_SEL
        2. 8.3.7.2 ENABLE
        3. 8.3.7.3 LOS_INT_N
        4. 8.3.7.4 LOCK
        5. 8.3.7.5 SMBus MODE
        6. 8.3.7.6 SMBus READ/WRITE Transaction
        7. 8.3.7.7 SPI Mode
          1. 8.3.7.7.1 SPI READ/WRITE Transaction
          2. 8.3.7.7.2 SPI Write Transaction Format
          3. 8.3.7.7.3 SPI Read Transaction Format
        8. 8.3.7.8 SPI Daisy Chain
          1. 8.3.7.8.1 SPI Daisy Chain Write Example
          2. 8.3.7.8.2 SPI Daisy Chain Write Read Example
            1. 8.3.7.8.2.1 SPI Daisy Chain Length of Daisy Chain Illustration
      8. 8.3.8 Power-On Reset
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 Global Registers
      2. 8.6.2 Receiver Registers
      3. 8.6.3 CDR Registers
      4. 8.6.4 Transmitter Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 General Guidance for All Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
    4. 9.4 Initialization Set Up
      1. 9.4.1 Selective Data Rate Lock
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Solder Profile
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 開発サポート
    2. 12.2 ドキュメントのサポート
      1. 12.2.1 関連資料
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 コミュニティ・リソース
    5. 12.5 商標
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 Glossary
  13. 13メカニカル、パッケージ、および注文情報

7.4 Thermal Information

THERMAL METRIC(1)(2) UNIT
RTW (WQFN)
24 PINS
RθJA Junction-to-ambient thermal resistance 34 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 31.4 °C/W
RθJB Junction-to-board thermal resistance 11.8 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 11.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.7 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
(2) No heat sink is assumed for these estimations. Depending on the application, a heat sink, faster air flow, and/or reduced ambient temperature ( < 85ºC) may be required in order to maintain the maximum junction temperature specified in Electrical Characteristics.