JAJSG09F October   2015  – December 2019 MSP430FR2433

PRODUCTION DATA.  

  1. 1デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2改訂履歴
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
    4. 4.4 Pin Multiplexing
    5. 4.5 Buffer Types
    6. 4.6 Connection of Unused Pins
  5. 5Specifications
    1. 5.1       Absolute Maximum Ratings
    2. 5.2       ESD Ratings
    3. 5.3       Recommended Operating Conditions
    4. 5.4       Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5       Active Mode Supply Current Per MHz
    6. 5.6       Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
    7. 5.7       Low-Power Mode (LPM3 and LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8       Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    9. 5.9       Typical Characteristics - Low-Power Mode Supply Currents
    10. Table 5-1 Typical Characteristics – Current Consumption Per Module
    11. 5.10      Thermal Resistance Characteristics
    12. 5.11      Timing and Switching Characteristics
      1. 5.11.1  Power Supply Sequencing
        1. Table 5-2 PMM, SVS and BOR
      2. 5.11.2  Reset Timing
        1. Table 5-3 Wake-up Times From Low-Power Modes and Reset
      3. 5.11.3  Clock Specifications
        1. Table 5-4 XT1 Crystal Oscillator (Low Frequency)
        2. Table 5-5 DCO FLL, Frequency
        3. Table 5-6 DCO Frequency
        4. Table 5-7 REFO
        5. Table 5-8 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        6. Table 5-9 Module Oscillator (MODOSC)
      4. 5.11.4  Digital I/Os
        1. Table 5-10 Digital Inputs
        2. Table 5-11 Digital Outputs
        3. 5.11.4.1   Typical Characteristics – Outputs at 3 V and 2 V
      5. 5.11.5  VREF+ Built-in Reference
        1. Table 5-12 VREF+
      6. 5.11.6  Timer_A
        1. Table 5-13 Timer_A
      7. 5.11.7  eUSCI
        1. Table 5-14 eUSCI (UART Mode) Clock Frequency
        2. Table 5-15 eUSCI (UART Mode)
        3. Table 5-16 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-17 eUSCI (SPI Master Mode)
        5. Table 5-18 eUSCI (SPI Slave Mode)
        6. Table 5-19 eUSCI (I2C Mode)
      8. 5.11.8  ADC
        1. Table 5-20 ADC, Power Supply and Input Range Conditions
        2. Table 5-21 ADC, 10-Bit Timing Parameters
        3. Table 5-22 ADC, 10-Bit Linearity Parameters
      9. 5.11.9  FRAM
        1. Table 5-23 FRAM
      10. 5.11.10 Debug and Emulation
        1. Table 5-24 JTAG, Spy-Bi-Wire Interface
        2. Table 5-25 JTAG, 4-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Standard Interface
    7. 6.7  Spy-Bi-Wire Interface (SBW)
    8. 6.8  FRAM
    9. 6.9  Memory Protection
    10. 6.10 Peripherals
      1. 6.10.1  Power-Management Module (PMM)
      2. 6.10.2  Clock System (CS) and Clock Distribution
      3. 6.10.3  General-Purpose Input/Output Port (I/O)
      4. 6.10.4  Watchdog Timer (WDT)
      5. 6.10.5  System (SYS) Module
      6. 6.10.6  Cyclic Redundancy Check (CRC)
      7. 6.10.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 6.10.8  Timers (Timer0_A3, Timer1_A3, Timer2_A2 and Timer3_A2)
      9. 6.10.9  Hardware Multiplier (MPY)
      10. 6.10.10 Backup Memory (BAKMEM)
      11. 6.10.11 Real-Time Clock (RTC)
      12. 6.10.12 10-Bit Analog-to-Digital Converter (ADC)
      13. 6.10.13 Embedded Emulation Module (EEM)
    11. 6.11 Input/Output Diagrams
      1. 6.11.1 Port P1 Input/Output With Schmitt Trigger
      2. 6.11.2 Port P2 (P2.0 to P2.2) Input/Output With Schmitt Trigger
      3. 6.11.3 Port P2 (P2.3 to P2.7) Input/Output With Schmitt Trigger
      4. 6.11.4 Port P3 (P3.0 to P3.2) Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptors
    13. 6.13 Memory
      1. 6.13.1 Memory Organization
      2. 6.13.2 Peripheral File Map
    14. 6.14 Identification
      1. 6.14.1 Revision Identification
      2. 6.14.2 Device Identification
      3. 6.14.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Layout Guidelines
  8. 8デバイスおよびドキュメントのサポート
    1. 8.1 使い始めと次の手順
    2. 8.2 デバイスの項目表記
    3. 8.3 ツールとソフトウェア
    4. 8.4 ドキュメントのサポート
    5. 8.5 Community Resources
    6. 8.6 商標
    7. 8.7 静電気放電に関する注意事項
    8. 8.8 Export Control Notice
    9. 8.9 Glossary
  9. 9メカニカル、パッケージ、および注文情報

2 改訂履歴

リビジョン E からリビジョン F への変更点

Changes from August 20, 2019 to December 9, 2019

  • Changed the note that begins "Supply voltage changes faster than 0.2 V/µs can trigger a BOR reset..." in Section 5.3, Recommended Operating ConditionsGo
  • Added the note that begins "TI recommends that power to the DVCC pin must not exceed the limits..." in Section 5.3, Recommended Operating ConditionsGo
  • Changed the note that begins "A capacitor tolerance of ±20% or better is required..." in Section 5.3, Recommended Operating ConditionsGo
  • Changed the note that begins "Requires external capacitors at both terminals..." in Table 5-4, XT1 Crystal Oscillator (Low Frequency)Go
  • Added the t(int) parameter in Table 5-10, Digital InputsGo
  • Corrected the test conditions for the RI,MUX parameter in Table 5-20, ADC, Power Supply and Input Range ConditionsGo
  • Added the note that begins "tSample = ln(2n+1) × τ ..." in Table 5-21, ADC, 10-Bit Timing ParametersGo
  • Changed the CRC covered end address to 0x1AF5 in note (1) in Table 6-22, Device DescriptorsGo

Changes from September 11, 2018 to August 19, 2019

  • Changed the parameter symbol from RI to RI,MUX in Table 5-20 , ADC, Power Supply and Input Range ConditionsGo
  • Added RI,Misc TYP value of 34 kΩ in Table 5-20 , ADC, Power Supply and Input Range ConditionsGo
  • Added formula for RI calculation in Table 5-21 , ADC, 10-Bit Timing ParametersGo
  • Removed the description of "±3°C" in table note that starts "The device descriptor structure ..." of Table 5-22, ADC, 10-Bit Linearity ParametersGo
  • Corrected bitfield from IRDSEL to IRDSSEL in Section 6.10.8, Timers (Timer0_A3, Timer1_A3, Timer2_A2 and Timer3_A2), in the description that starts "The interconnection of Timer0_A3 and ..."Go
  • Corrected the ADCINCHx column heading in Table 6-15, ADC Channel ConnectionsGo
  • Corrected the ADCSHSx column heading in Table 6-16, ADC Trigger Signal ConnectionsGo
  • Added P1SELC information in Table 6-32, Port P1, P2 Registers (Base Address: 0200h)Go
  • Added P2SELC information in Table 6-32, Port P1, P2 Registers (Base Address: 0200h)Go
  • Added P3SELC information in Table 6-33, Port P3 Registers (Base Address: 0220h)Go

Changes from August 29, 2018 to September 10, 2018

  • Removed SYNC signal (not supported) from Figure 4-1, 32-Pin RHB Package (Top View)Go
  • Combined two YQW pinout figures into one, and removed SYNC signal (not supported) in Figure 4-2, 24-Pin YQW Package (Top and Bottom Views)Go
  • Removed SYNC signal (not supported) from figure and table in Section 6.11.2, Port P2 (P2.0 to P2.2) Input/Output With Schmitt TriggerGo

Changes from June 20, 2017 to August 28, 2018

  • Updated Section 3.1, Related ProductsGo
  • Corrected description of pin C5 on YQW package (changed from DVSS to NC) in Table 4-1, Pin AttributesGo
  • Corrected typos in the pin numbers of P2.3,5,6 in the RGE package in Table 4-2Go
  • Corrected typos in the pin numbers of UCA1RXD and UCA1TXD in the RGE package in Table 4-2Go
  • Changed description of NC pins from "No internal connection" to "No connection" in Table 4-2, Signal DescriptionsGo
  • Corrected package type in VQFN row (changed from QFN to VQFN) in Table 4-2, Signal DescriptionsGo
  • Changed HBM limit to ±1000 V and CDM limit to ±250 V in Section 5.2, ESD RatingsGo
  • Added note to VSVSH- and VSVSH+ parameters in Table 5-2, PMM, SVS and BORGo
  • Moved "FRAM access time error" to "System Reset" row and added ACCTEIFG to interrupt flag column in Table 6-2, Interrupt Sources, Flags, and VectorsGo
  • Corrected the offset for P2SEL1 in Table 6-32, Port P1, P2 Registers (Base Address: 0200h)Go
  • Section 8.2「デバイスの項目表記」のテキストおよび図を更新Go

Changes from June 9, 2017 to June 19, 2017

  • Figure 1-1「機能ブロック図」のFRAMおよびRAMのサイズを訂正Go

Changes from October 21, 2015 to June 8, 2017

  • 一覧の「広い電源電圧範囲」を含む項目に注を追加Go
  • Section 1.1「特長」の「パッケージ・オプション」一覧に DSBGA (YQW) パッケージを追加Go
  • Section 1.3「概要」の製品情報の表にDSBGA (YQW)パッケージ・オプションを追加Go
  • Added row for MSP430FR2433IYQW to Table 3-1, Device ComparisonGo
  • Added Section 3.1, Related ProductsGo
  • Added DSBGA (YQW) package to Table 4-1, Pin AttributesGo
  • Added DSBGA (YQW) package to Table 4-2, Signal DescriptionsGo
  • Added row for VQFN thermal padGo
  • Removed FRAM reflow noteGo
  • In the note that starts "Low-power mode 3, VLO, excludes SVS test conditions...", changed "fXT1 = 0 Hz" to "fXT1 = 32768 Hz"Go
  • Added DSBGA (YQW) package and changed notes for Section 5.10, Thermal Resistance CharacteristicsGo
  • Added note that starts "The VLO clock frequency is reduced by 15%..."Go
  • Removed ADCDIV from the formula for the TYP value in the second row of the tCONVERT parameter in Table 5-21, ADC, 10-Bit Timing Parameters (removed because ADCCLK is after division)Go
  • Added note to "Clock" in Table 6-1, Operating ModesGo
  • Added note that starts "XT1CLK and VLOCLK can be active during LPM4..."Go
  • Add description of blank device detectionGo
  • Corrected description in Section 6.10.10, Backup Memory (BKMEM)Go
  • Changed the paragraph that starts "Quickly switching digital signals and ..." in Section 7.2.1.2, Design RequirementsGo
  • Figure 8-1「デバイスの項目表記」を更新Go
  • 従来の「開発ツールのサポート」セクションをSection 8.3、「ツールとソフトウェア」に置き換えGo
  • Section 8.4「ドキュメントのサポート」の形式および内容を更新Go