JAJSGI5D November   2018  – June 2022 TLIN1441-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings, IEC Specification
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Supply Characteristics
    7. 7.7 Electrical Characteristics
    8. 7.8 AC Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Circuit: Diagrams and Waveforms
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  LIN Pin
        1. 9.3.1.1 LIN Transmitter Characteristics
        2. 9.3.1.2 LIN Receiver Characteristics
          1. 9.3.1.2.1 Termination
      2. 9.3.2  TXD (Transmit Input)
      3. 9.3.3  RXD (Receive Output)
      4. 9.3.4  WAKE (High Voltage Local Wake Up Input)
      5. 9.3.5  WDT/CLK (Pin Programmable Watchdog Delay Input/SPI Clock)
      6. 9.3.6  WDI/SDI (Watchdog Timer Input/SPI Serial Data In)
      7. 9.3.7  PIN/nCS (Pin Watchdog Select/SPI Chip Select)
      8. 9.3.8  LIMP (LIMP Home output – High Voltage Open Drain Output)
      9. 9.3.9  nWDR/SDO (Watchdog Timeout Reset Output/SPI Serial Data Out)
      10. 9.3.10 VSUP (Supply Voltage)
      11. 9.3.11 GND (Ground)
      12. 9.3.12 EN/nINT (Enable Input/Interrupt Output in SPI Mode)
      13. 9.3.13 nRST/nWDR (Reset Output/Watchdog Timeout Reset Output)
      14. 9.3.14 VCC (Supply Output)
      15. 9.3.15 Protection Features
        1. 9.3.15.1 TXD Dominant Time Out (DTO)
        2. 9.3.15.2 Bus Stuck Dominant System Fault: False Wake Up Lockout
        3. 9.3.15.3 Thermal Shutdown
        4. 9.3.15.4 Under Voltage on VSUP
        5. 9.3.15.5 Unpowered Device and LIN Bus
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Sleep Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Failsafe Mode
      5. 9.4.5 Wake-Up Events
        1. 9.4.5.1 Wake-Up Request (RXD)
        2. 9.4.5.2 Local Wake Up (LWU) via WAKE Terminal
      6. 9.4.6 Mode Transitions
      7. 9.4.7 Voltage Regulator
        1. 9.4.7.1 VCC
        2. 9.4.7.2 Output Capacitance Selection
        3. 9.4.7.3 Low-Voltage Tracking
        4. 9.4.7.4 Power Supply Recommendation
      8. 9.4.8 Watchdog
        1. 9.4.8.1 Watchdog Error Counter
        2. 9.4.8.2 Pin Control Mode
        3. 9.4.8.3 SPI Control Programming
        4. 9.4.8.4 Watchdog Timing
    5. 9.5 Programming
      1. 9.5.1 SPI Communication
        1. 9.5.1.1 Chip Select Not (nCS)
        2. 9.5.1.2 Serial Clock Input (CLK)
        3. 9.5.1.3 Serial Data Input (SDI)
        4. 9.5.1.4 Serial Data Output (SDO)
    6. 9.6 Registers
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Normal Mode Application Note
        2. 10.2.1.2 Standby Mode Application Note
        3. 10.2.1.3 TXD Dominant State Timeout Application Note
      2. 10.2.2 Detailed Design Procedures
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 サポート・リソース
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

7.5 Thermal Information

THERMAL METRIC(1)DMT UNIT
14 PINS
RθJAJunction-to-ambient thermal resistance35.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance35.3°C/W
RθJBJunction-to-board thermal resistance11.8°C/W
ψJTJunction-to-top characterization parameter0.5°C/W
ψJBJunction-to-board characterization parameter11.8°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance2.0°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.