JAJSH18A March   2019  – September 2019 TPS7A78

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      ハーフブリッジ構成の標準的な回路図
      2.      フルブリッジ構成の標準的な回路図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Active Bridge Control
      2. 8.3.2 Full-Bridge (FB) and Half-Bridge (HB) Configurations
      3. 8.3.3 4:1 Switched-Capacitor Voltage Reduction
      4. 8.3.4 Undervoltage Lockout Circuits (VUVLO_SCIN) and (VUVLO_LDO_IN)
      5. 8.3.5 Dropout Voltage Regulation
      6. 8.3.6 Current Limit
      7. 8.3.7 Programmable Power-Fail Detection
      8. 8.3.8 Power-Good (PG) Detection
      9. 8.3.9 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation
      2. 8.4.2 Dropout Mode
      3. 8.4.3 Disabled Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Recommended Capacitor Types
      2. 9.1.2 Input and Output Capacitors Requirements
      3. 9.1.3 Startup Behavior
      4. 9.1.4 Load Transient
      5. 9.1.5 Standby Power and Output Efficiency
      6. 9.1.6 Reverse Current
      7. 9.1.7 Switched-Capacitor Stage Output Impedance
      8. 9.1.8 Power Dissipation (PD)
      9. 9.1.9 Estimating Junction Temperature
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Calculating the Cap-Drop Capacitor CS
          1. 9.2.2.1.1 CS Calculations for the Typical Design
        2. 9.2.2.2 Calculating the Surge Resistor RS
          1. 9.2.2.2.1 RS Calculations for the Typical Design
        3. 9.2.2.3 Checking for the Device Maximum ISHUNT Current
          1. 9.2.2.3.1 ISHUNT Calculations for the Typical Design
        4. 9.2.2.4 Calculating the Bulk Capacitor CSCIN
          1. 9.2.2.4.1 CSCIN Calculations for the Typical Design
        5. 9.2.2.5 Calculating the PFD Pin Resistor Dividers for a Power-Fail Detection
          1. 9.2.2.5.1 PFD Pin Resistor Divider Calculations for the Typical Design
        6. 9.2.2.6 Summary of the Typical Application Design Components
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 開発サポート
        1. 12.1.1.1 評価基板
        2. 12.1.1.2 SIMPLIS モデル
      2. 12.1.2 デバイスの項目表記
    2. 12.2 ドキュメントのサポート
      1. 12.2.1 関連資料
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 コミュニティ・リソース
    5. 12.5 商標
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 Glossary
  13. 13メカニカル、パッケージ、および注文情報

7.4 Thermal Information

THERMAL METRIC(1)(2) TPS7A78 UNIT
PWP (TSSOP)
14 PINS
RθJA Junction-to-ambient thermal resistance 48.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 44.0 °C/W
RθJB Junction-to-board thermal resistance 24.2 °C/W
ΨJT Junction-to-top characterization parameter 1.6 °C/W
ΨJB Junction-to-board characterization parameter 24.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Thermal metrics were modeled on a JEDEC Hi-K board in order to provide a standardized layout and measurement technique for comparison purposes.The  An empirical analysis of the impact of board layout on LDO thermal performance application report goes into detail on how board layout impacts the thermal performance of linear regulators.