JAJSH18A March   2019  – September 2019 TPS7A78

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      ハーフブリッジ構成の標準的な回路図
      2.      フルブリッジ構成の標準的な回路図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Active Bridge Control
      2. 8.3.2 Full-Bridge (FB) and Half-Bridge (HB) Configurations
      3. 8.3.3 4:1 Switched-Capacitor Voltage Reduction
      4. 8.3.4 Undervoltage Lockout Circuits (VUVLO_SCIN) and (VUVLO_LDO_IN)
      5. 8.3.5 Dropout Voltage Regulation
      6. 8.3.6 Current Limit
      7. 8.3.7 Programmable Power-Fail Detection
      8. 8.3.8 Power-Good (PG) Detection
      9. 8.3.9 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation
      2. 8.4.2 Dropout Mode
      3. 8.4.3 Disabled Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Recommended Capacitor Types
      2. 9.1.2 Input and Output Capacitors Requirements
      3. 9.1.3 Startup Behavior
      4. 9.1.4 Load Transient
      5. 9.1.5 Standby Power and Output Efficiency
      6. 9.1.6 Reverse Current
      7. 9.1.7 Switched-Capacitor Stage Output Impedance
      8. 9.1.8 Power Dissipation (PD)
      9. 9.1.9 Estimating Junction Temperature
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Calculating the Cap-Drop Capacitor CS
          1. 9.2.2.1.1 CS Calculations for the Typical Design
        2. 9.2.2.2 Calculating the Surge Resistor RS
          1. 9.2.2.2.1 RS Calculations for the Typical Design
        3. 9.2.2.3 Checking for the Device Maximum ISHUNT Current
          1. 9.2.2.3.1 ISHUNT Calculations for the Typical Design
        4. 9.2.2.4 Calculating the Bulk Capacitor CSCIN
          1. 9.2.2.4.1 CSCIN Calculations for the Typical Design
        5. 9.2.2.5 Calculating the PFD Pin Resistor Dividers for a Power-Fail Detection
          1. 9.2.2.5.1 PFD Pin Resistor Divider Calculations for the Typical Design
        6. 9.2.2.6 Summary of the Typical Application Design Components
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 開発サポート
        1. 12.1.1.1 評価基板
        2. 12.1.1.2 SIMPLIS モデル
      2. 12.1.2 デバイスの項目表記
    2. 12.2 ドキュメントのサポート
      1. 12.2.1 関連資料
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 コミュニティ・リソース
    5. 12.5 商標
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 Glossary
  13. 13メカニカル、パッケージ、および注文情報

9.1.9 Estimating Junction Temperature

The JEDEC standard recommends the use of psi (Ψ) thermal metrics to estimate the junction temperatures of the linear regulator when in circuit on a typical PCB board application. These metrics are not thermal resistance parameters and instead offer a practical and relative way to estimate junction temperature. These psi metrics are determined to be significantly independent of the copper area available for heat spreading. The Thermal Information table lists the primary thermal metrics, which are the junction-to-top characterization parameter (ψJT) and junction-to-board characterization parameter (ψJB). These parameters provide two methods for calculating the junction temperature (TJ). As described in the Semiconductor and IC Package Thermal Metrics application report, use the junction-to-top characterization parameter (ψJT) with the temperature at the center-top of device package (TT) to calculate the junction temperature. As described in the Semiconductor and IC Package Thermal Metrics application report, use the junction-to-board characterization parameter (ψJB) with the PCB surface temperature 1 mm from the device package (TB) to estimate the junction temperature.

Equation 6. TJ = TT + ψJT × PD_Total

where

  • PD_Total is the total dissipated power in the device
  • TT is the temperature at the center-top of the device package
Equation 7. TJ = TB + ψJB × PD

where

  • TB is the PCB surface temperature measured 1 mm from the device package and centered on the package edge

For detailed information on the thermal metrics and how to use them, see the Semiconductor and IC Package Thermal Metrics application report.