JAJSIY4 April   2020 TPS7B81

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 説明
    1.     Device Images
      1.      代表的なアプリケーションの回路図
      2.      静止電流と周囲温度の関係 (VOUT = 3.3V)
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Enable (EN)
      2. 7.3.2 Undervoltage Shutdown
      3. 7.3.3 Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN Lower Than 3 V
      2. 7.4.2 Operation With VIN Larger Than 3 V
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Power Dissipation
        1. 8.1.1.1 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor
        2. 8.2.2.2 Output Capacitor
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 サポート・リソース
    3. 11.3 商標
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 Glossary
  12. 12メカニカル、パッケージ、および注文情報

6.4 Thermal Information

THERMAL METRIC(1) TPS7B81 UNIT
DGN
(HVSSOP)		 DRV
(WSON)
8 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 63.9 72.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.2 85.8 °C/W
RθJB Junction-to-board thermal resistance 22.6 37.4 °C/W
ψJT Junction-to-top characterization parameter 1.8 2.7 °C/W
ψJB Junction-to-board characterization parameter 22.3 37.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 12.1 13.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.