JAJSJD6A July   2021  – December 2021 TPS22992

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics (VBIAS = 5 V)
    6. 7.6  Electrical Characteristics (VBIAS = 3.3 V)
    7. 7.7  Electrical Characteristics (VBIAS = 1.5 V)
    8. 7.8  Switching Characteristics (VBIAS = 5 V)
    9. 7.9  Switching Characteristics (VBIAS = 3.3 V)
    10. 7.10 Switching Characteristics (VBIAS = 1.5 V)
    11. 7.11 Typical Characteristics
  8. 8 Timing Diagram
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 ON and OFF Control
      2. 9.3.2 Adjustable Quick Output Discharge
      3. 9.3.3 Adjustable Slew Rate
      4. 9.3.4 Power Good (PG) Signal
      5. 9.3.5 Thermal Shutdown
      6. 9.3.6 Short Circuit Protection (TPS22992S)
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Performance Plots
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 サポート・リソース
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

7.4 Thermal Information

THERMAL METRIC (1) TPS22992 UNIT
RXP (WQFN) RXN (WQFN)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 110.0 119.4 °C/W
ΨJT Junction-to-top characterization parameter 6.8 6.9 °C/W
YJB Junction-to-board characterization parameter 36.6 35.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.