THERMAL METRIC(1)(2) | LMT86-Q1 | UNIT |
---|
DCK (SOT/SC70) |
---|
5 PINS |
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RθJA | Junction-to-ambient thermal resistance (3)(4) | 275 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 84 | °C/W |
RθJB | Junction-to-board thermal resistance | 56 | °C/W |
ψJT | Junction-to-top characterization parameter | 1.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 55 | °C/W |
(1) For information on self-heating and thermal response time, see section
Section 8.4.1.
(3) The junction to ambient thermal resistance (RθJA) under natural convection is obtained in a simulation on a JEDEC-standard, High-K board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are included in the PCB, per JESD 51-5.
(4) Changes in output due to self-heating can be computed by multiplying the internal dissipation by the thermal resistance.