JAJSN61F May   2015  – March 2022 TUSB320

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 Cables, Adapters, and Direct Connect Devices
        1. 7.2.1.1 USB Type-C Receptacles and Plugs
        2. 7.2.1.2 USB Type-C Cables
        3. 7.2.1.3 Legacy Cables and Adapters
        4. 7.2.1.4 Direct Connect Devices
        5. 7.2.1.5 Audio Adapters
    3. 7.3 Feature Description
      1. 7.3.1 Port Role Configuration
        1. 7.3.1.1 Downstream Facing Port (DFP) – Source
        2. 7.3.1.2 Upstream Facing Port (UFP) – Sink
        3. 7.3.1.3 Dual Role Port (DRP)
      2. 7.3.2 Type-C Current Mode
      3. 7.3.3 Accessory Support
        1. 7.3.3.1 Audio Accessory
        2. 7.3.3.2 Debug Accessory
      4. 7.3.4 I2C and GPIO Control
      5. 7.3.5 VBUS Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Unattached Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 Dead Battery Mode
      4. 7.4.4 Shutdown Mode
    5. 7.5 Programming
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DRP in I2C Mode
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DFP in I2C Mode
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 UFP in I2C Mode
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 サポート・リソース
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Power Consumption
IUNATTACHED_UFPCurrent consumption in unattached mode when port is unconnected and waiting for connection. (VDD = 4.5 V, EN_N = L, ADDR = NC, PORT = L)100µA
IACTIVE_UFPCurrent consumption in active mode. (VDD = 4.5 V, EN_N = L, ADDR = NC, PORT = L)100µA
ISHUTDOWNLeakage current when VDD is supplied but the TUSB320 device is not enabled. (VDD = 4.5 V, EN_N = H)1.7µA
CC1 and CC2 Pins
RCC_DBPulldown resistor when in dead-battery mode.4.15.16.1kΩ
RCC_DPulldown resistor when in UFP or DRP mode.4.65.15.6kΩ
VUFP_CC_USBVoltage level range for detecting a DFP attach when configured as an UFP and DFP is advertising default current source capability.0.250.61V
VUFP_CC_MEDVoltage level range for detecting a DFP attach when configured as an UFP and DFP is advertising medium (1.5 A) current source capability.0.71.16V
VUFP_CC_HIGHVoltage level range for detecting a DFP attach when configured as an UFP and DFP is advertising high (3 A) current source capability.1.312.04V
VTH_DFP_CC_USBVoltage threshold for detecting an UFP attach when configured as a DFP and advertising default current source capability.1.511.61.64V
VTH_DFP_CC_MEDVoltage threshold for detecting an UFP attach when configured as a DFP and advertising medium current (1.5 A) source capability.1.511.61.64V
VTH_DFP_CC_HIGHVoltage threshold for detecting an UFP attach when configured as a DFP and advertising high current (3.0 A) source capability.2.462.62.74V
ICC_DEFAULT_PDefault mode pullup current source when operating in DFP or DRP mode.648096µA
ICC_MED_PMedium (1.5 A) mode pullup current source when operating in DFP or DRP mode.166180194µA
ICC_HIGH_PHigh (3 A) mode pullup current source when operating in DFP or DRP mode.(1)304330356µA
Control Pins: PORT, ADDR, INT/OUT3, EN_N, ID
VILLow-level control signal input voltage, (PORT, ADDR, EN_N)0.4V
VIMMid-level control signal input voltage (PORT, ADDR)0.28 × VDD0.56 × VDDV
VIHHigh-level control signal input voltage (PORT, ADDR, EN_N)VDD - 0.3V
IIHHigh-level input current–2020µA
IILLow-level input current–1010µA
REN_NInternal pullup resistance for EN_N1.1MΩ
Rpu(2)Internal pullup resistance (PORT, ADDR)588kΩ
Rpd (2)Internal pulldown resistance (PORT, ADDR)1.1MΩ
VOLLow-level signal output voltage (open-drain) (INT_N/OUT3, ID)IOL = –1.6 mA0.4V
Rp_ODextExternal pullup resistor on open drain IOs (INT_N/OUT3, ID)200kΩ
Rp_TLextTri-level input external pullup resistor (PORT, ADDR)4.7kΩ
I2C - SDA/OUT1, SCL/OUT2 can operate from 1.8 or 3.3 V (±10%)(3)
VDD_I2CSupply range for I2C (SDA/OUT1, SCL/OUT2)1.651.83.6V
VIHHigh-level signal voltage1.05V
VILLow-level signal voltage0.4V
VOLLow-level signal output voltage (open drain)IOL = –1.6 mA0.4V
VBUS_DET IO Pins (Connected to System VBUS signal)
VBUS_THRVBUS threshold rangeSee Figure 6-12.953.303.80V
RVBUSExternal resistor between VBUS and VBUS_DET pin855887920KΩ
RVBUS_PDInternal pulldown resistance for VBUS_DET95KΩ
(1) VDD must be 3.5 V or greater to advertise 3 A current.
(2) Internal pullup and pulldown for PORT and ADDR are removed after the device has sampled EN = high or EN_N = low.
(3) When using 3.3 V for I2C, customer must ensure VDD is above 3.0 V at all times.