JAJSRH6E February   2010  – November 2023 UCC27321-Q1 , UCC27322-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 概要 (続き)
  6. 5 Related Products
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
      3. 8.3.3 Source and Sink Capabilities During Miller Plateau
      4. 8.3.4 VDD
      5. 8.3.5 Drive Current and Power Requirements
      6. 8.3.6 Enable
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input-to-Output Configuration
        2. 9.2.2.2 Input Threshold Type
        3. 9.2.2.3 VDD Bias Supply Voltage
        4. 9.2.2.4 Peak Source and Sink Currents
        5. 9.2.2.5 Enable and Disable Function
        6. 9.2.2.6 Propagation Delay
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
    1.     40
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
    4. 11.4 Power Dissipation
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 サード・パーティ製品に関する免責事項
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 サポート・リソース
    5. 12.5 Trademarks
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 用語集
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)(2)(3)UCC2732x-Q1UCC27322-Q1UNIT
D (SOIC)DGN (MSOP-PowerPAD)
8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance11358.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance61.745.3°C/W
RθJBJunction-to-board thermal resistance53.234.3°C/W
ψJTJunction-to-top characterization parameter161.7°C/W
ψJBJunction-to-board characterization parameter52.734°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance—11.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) In general, the system designer must attempt to use larger traces on the PCB where possible to spread the heat away from the device more effectively. For information on the PowerPAD package, see PowerPad™ Thermally Enhanced Package and PowerPad™ Made Easy.
(3) The PowerPAD thermal pad is not directly connected to any leads of the package. However, it is electrically and thermally connected to the substrate, which is the ground of the device.