JAJSUK6A May 2024 – October 2024 MSPM0L1227 , MSPM0L1228 , MSPM0L2227 , MSPM0L2228
PRODUCTION DATA
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP MCU devices and support tools. . Each MSP MCU commercial family member has one of two prefixes: MSP or X. These prefixes represent evolutionary stages of product development from engineering prototypes (X) through fully qualified production devices (MSP).
X – Experimental device that is not necessarily representative of the final device's electrical specifications
MSP – Fully qualified production device
X devices are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes." MSP devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature range, package type, and distribution format. Figure 10-1 provides a legend for reading the complete device name.
Processor Family |
MSP = Mixed-signal processor X= Experimental silicon |
MCU Platform | M0 = Arm based 32-bit M0+ |
Product Family | L = 32MHz frequency |
Device Subfamily |
1227 = ADC, CMP, VBAT 222x = ADC, CMP, VBAT, LCD |
Flash Memory |
7 = 128KB 8 = 256KB |
Temperature Range |
S = –40°C to 125°C |
Package Type | See the Device Comparison section and https://www.ti.com/packaging |
Distribution Format |
R = Large reel No marking = Tube or tray |
For orderable part numbers of MSP devices in different package types, see the Package Option Addendum of this document, ti.com, or contact your TI sales representative.