SBAU390A September   2021  – April 2024 TMAG5170 , TMAG5170-Q1 , TMAG5173-Q1 , TMAG5273

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Assembly Guide
  6. 3Revision History

Abstract

This document serves to accompany the design files for the SLIDEBY-MAG-ACC attachment for the magnetic sensing evaluation kits (EVMs) that interface with TI-SCB such as the TMAG5170 EVM. In addition to this guide, the design files are provided as an example and may be used in a 3D printer to generate a demonstration of tracking linear movement using a three-dimensional Hall effect sensor.

Note: Design files described in this document can be downloaded from Slide-By Design Files.