SBOA384 September 2020 TLV9062-Q1 , TLV9064-Q1
This section provides a Failure Mode Analysis (FMA) for the pins of the TLV9062-Q1 (SOIC (8) and VSSOP (8) packages) and TLV9064-Q1 (TSSOP (14) and SOIC (14) packages). The failure modes covered in this document include the typical pin-by-pin failure scenarios:
Table 4-2 through Table 4-8 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
Class | Failure Effects |
---|---|
A | Potential device damage that affects functionality |
B | No device damage, but loss of functionality |
C | No device damage, but performance degradation |
D | No device damage, no impact to functionality or performance |