SBOK063 October 2022 SN54SLC8T245-SEP
A new device can be qualified either by performing a full scale quality and reliability test on the actual device or using one or more previously qualified devices through Qualification by Similarity (QBS) rules. By establishing similarities between the new device and those qualified previously, repetitive tests were eliminated, allowing for a timely production release. Qualifying the differences between a previously qualified product and the new product under consideration was emphasized when adopting the QBS methodology.
The QBS rules for a technology, product, test parameter, or package defines which attributes are required to remain fixed for the QBS rules to apply. The expected attributes that were allowed to vary was reviewed, and a QBS plan was developed based on the previous reliability impact assessment, specifying what subset of the full complement of environmental stresses were required to evaluate the reliability impact of those variations. Each new device was reviewed for the conformance to the QBS rule sets applicable to the device. For more information, see JEDEC JESD47.
| Note that qualification by similarity (qualification family) per JEDEC JESD47 is allowed | ||||
|---|---|---|---|---|
| Description | Condition | Sample Size Used/Rejects | Lots Required | Test Method |
| Electromigration | Maximum recommended operating conditions | N/A | N/A | Per TI design rules |
| Wire bond life | Maximum recommended operating conditions | N/A | N/A | Per TI design rules |
| Electrical characterization | TI data sheet | 30 | 1 | N/A |
| Electrostatic discharge sensitivity | HBM | 3 units/voltage | 1 | EIA/JESD22-A114 |
| CDM | EIA/JESD22-C101 | |||
| Latch-up | Per technology | 6/0 | 1 | EIA/JESD78 |
| Physical dimensions | TI data sheet | 5/0 | 1 | EIA/JESD22- B100 |
| Thermal impedance | Theta-JA on board | Per Pin-Package | N/A | EIA/JESD51 |
| Bias life test | 125°C / 1000 hours or equivalent | 77/0 | 3 | JESD22-A108(1) |
| Biased HAST | 130°C / 85% / 96 hours | 77/0 | 3 | JESD22-A110(1) |
| Extended biased HAST | 130°C / 85% / 250 hours (for reference) | 77/0 | 1 | JESD22-A110(1) |
| Unbiased HAST | 130°C / 85% / 96 hours | 77/0 | 3 | JESD22-A110(1) |
| Temperature cycle | −65°C to +150°C non-biased for 500 cycles | 77/0 | 3 | JESD22-A104(1) |
| Solder heat | 260°C for 10 seconds | 22/0 | 1 | JESD22-B106 |
| Resistance to solvents | Ink symbol only | 12/0 | 1 | JESD22-B107 |
| Solderability | Condition A (steam age for 8 hours) | 22/0 | 1 | ANSI/J-STD-002-92 |
| Flammability | Method A / Method B | 5/0 | 1 | UL-1964 |
| Bond shear | Per wire size | 5 units × 30/0 bonds | 3 | JESD22-B116 |
| Bond pull strength | Per wire size | 5 units × 30/0 bonds | 3 | ASTM F-459 |
| Die shear | Per die size | 5/0 | 3 | TM 2019 |
| High temperature storage | 150°C / 1,000 hours | 15/0 | 3 | JESD22-A103-A(1) |
| Moisture sensitivity | Surface mount only | 12 | 1 | J-STD-020-A(1) |
| Radiation response characterization | Total ionization dose, and single-event latchup | 5 units/dose level | 1 | MIL-STD-883/Method 1019 |
| Outgassing characterization | TML (Total mass lost), CVCM (collected volatile condensable material), WVR (water vapor recorded) | 5 | 1 | ASTM E595 |