SBOU296A April   2023  – September 2023 PGA855

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Overview
    1. 1.1 Related Documentation
    2. 1.2 Electrostatic Discharge Caution
    3. 1.3 Hot Surface Warning
  5. 2EVM Circuit Description
  6. 3Jumper Settings
  7. 4Power-Supply Connections
  8. 5Analog Input and Output Connections
  9. 6Digital Input Pins and Gain Control
  10. 7Modifications
  11. 8Schematic, PCB Layout, and Bill of Materials
    1. 8.1 Schematic
    2. 8.2 PCB Layout
    3. 8.3 Bill of Materials
  12. 9Revision History

Related Documentation

The following document provides information regarding Texas Instruments integrated circuits used in the assembly of the PGA855EVM. This user's guide is available from the TI website under literature number SBOU296. Any letter appended to the literature number corresponds to the document revision that is current at the time of the writing of this document. Newer revisions are available from the TI website at https://www.ti.com/, or call the Texas Instruments Literature Response Center at (800) 477-8924 or the Product Information Center at (972) 644-5580. When ordering, identify the document by both title and literature number.

Table 1-1 Related Documentation
DeviceLiterature Number
PGA855SBOSAE0