SCDU025 May   2021 TMUX646

 

  1.   Trademarks
  2. 1Introduction
  3. 2Information About Cautions and Warnings
  4. 3Features of this EVM
  5. 4EVM Images
  6. 5EVM Setup
  7. 6PCB Layouts
  8. 7Schematics
  9. 8Bill of Materials
  10. 9Related Documentation

3 Features of this EVM

The EVM has the following features:

  • A TMUX646 in a small BGA (ZEC) package

  • 1 power supply decoupling capacitor attached (0.1 µF)

  • Additional 0805 pad for additional supply decoupling capacitor.

  • Quick prototyping and DC testing of the 36 pin TMUX646 in the BGA (ZEC) package

  • All 34 signal paths have test points attached to allow for flexible measurements

  • All 30 drain and source pins have 805 pads for differential or single ended loads

  • All analog I/O and digital input pins have jumpers that connect to VDD and Ground

  • Additional TMUX646ZEC IC pad with SMA pads for 1 differential channel (CLK) and termination resistor pads for unused channels