2 Single-Event Effects (SEE)

The primary single-event effect (SEE) event of interest in the SN54SC6T07-SEP is the destructive single-event latch-up. From a risk or impact perspective, the occurrence of an SEL is potentially the most destructive SEE event and the biggest concern for space applications. In mixed technologies such as the Linear BiCMOS (LBC9) process used for SN54SC6T07-SEP, the CMOS circuitry introduces a potential SEL susceptibility. SEL can occur if excess current injection caused by the passage of an energetic ion is high enough to trigger the formation of a parasitic cross-coupled PNP and NPN bipolar structure (formed between the p-substrate and n-well and n+ and p+ contacts). The parasitic bipolar structure initiated by a single-event creates a high conductance path (inducing a steady-state current that is typically orders-of-magnitude higher than the normal operating current) between power and ground that persists (is latched) until power is removed or until the device is destroyed by the high-current state. The process modifications applied for SEL-mitigation were sufficient, as the SN54SC6T07-SEP exhibited no SEL with heavy-ions up to an LETEFF of 43MeV-cm² / mg at a fluence of 1 × 10⁷ ions / cm² and a chip temperature of 125°C.

Figure 2-1 Functional Block Diagram of the SN54SC6T07-SEP