SFFS061 February 2021 TLV759P
The failure mode distribution estimation for TLV759P in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.
Die Failure Modes | Failure Mode Distribution (%) |
---|---|
VOUT High (Following VIN) | 20.83% |
VOUT Not in Specification or Removed from Load | 8.33% |
VOUT Low (No Output) | 33.33% |
No Failures | 29.17% |
Output always enabled | 4.17% |
Possible FB pin damage | 4.17% |