SFFS246 August   2022 TCAN4550-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Hardware Component Failure Modes Effects and Diagnostics Analysis (FMEDA)
    1. 2.1 Random Fault Estimation
      1. 2.1.1 Fault Rate Estimation Theory for Packaging
      2. 2.1.2 Fault Estimation Theory for Silicon Permanent Faults
      3. 2.1.3 Fault Estimation Theory for Silicon Transient Faults
      4. 2.1.4 The Classification of Failure Categories and Calculation
    2. 2.2 Using the FMEDA Spreadsheet Tool
      1. 2.2.1 Mission Profile Tailoring Tab
        1. 2.2.1.1 Geographical Location
        2. 2.2.1.2 Life Cycle
        3. 2.2.1.3 Use Case Thermal Management Control (Theta-Ja) and Use Case Power
        4. 2.2.1.4 Safe vs Non-Safe (Safe Fail Fraction) for Each Component Type
        5. 2.2.1.5 Analog FIT Distribution Method
        6. 2.2.1.6 Operational Profile
      2. 2.2.2 Pin Level Tailoring Tab
      3. 2.2.3 Function and Diag Tailoring Tab
      4. 2.2.4 Diagnostic Coverage Tab
      5. 2.2.5 Customer Defined Diagnostics Tab
      6. 2.2.6 Totals - ISO26262 Tab
      7. 2.2.7 Details - ISO26262 Tab
    3. 2.3 Example Calculation of Metrics
      1. 2.3.1 Assumptions of Use for Calculation of Safety Metrics
      2. 2.3.2 Summary of ISO 26262 Safety Metrics at Device Level

2.2.5 Customer Defined Diagnostics Tab

The user may or may not need to tailor this sheet depending on their specific use-case.

The 'Customer Defined Diagnostics' tab is present for the user to further modify the diagnostics beyond the defaults in the 'Diagnostic Coverage' tab. These customer defined diagnostic are built into the selections in the 'Pin Level Tailoring' tab and 'Function and Diag Tailoring' tab. If the user has a unique set of diagnostics that will be run to replace the TI recommended diagnostics, they can use one of the customer defined options, fill in the coverage details, and then move to the 'Function and Diag Tailoring' tab and apply that diagnostic to the appropriate row.