SFFS392A september 2022 – may 2023 TMP1827
The failure mode distribution estimation for the TMP1827 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity, and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures resulting from misuse or overstress.
Die Failure Modes | Failure Mode Distribution (%) |
---|---|
Serial Communication Error | 15% |
ADC offset out of specification | 10% |
ADC gain out of specification | 15% |
ADC conversion output code bit error | 20% |
Scratchpad data bit error | 20% |
Internal capacitor fail to charge | 20% |