SFFS819 May   2024 RES11A-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1  SOT-23-THIN Package: RES11A10-Q1
    2. 2.2  SOT-23-THIN Package: RES11A15-Q1
    3. 2.3  SOT-23-THIN Package: RES11A16-Q1
    4. 2.4  SOT-23-THIN Package: RES11A20-Q1
    5. 2.5  SOT-23-THIN Package: RES11A25-Q1
    6. 2.6  SOT-23-THIN Package: RES11A30-Q1
    7. 2.7  SOT-23-THIN Package: RES11A40-Q1
    8. 2.8  SOT-23-THIN Package: RES11A50-Q1
    9. 2.9  SOT-23-THIN Package: RES11A90-Q1
    10. 2.10 SOT-23-THIN Package: RES11A00-Q1
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)

3 Failure Mode Distribution (FMD)

The failure mode distribution estimation for the RES11A-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity, and from best engineering judgment.

The failure modes listed in this section reflect random failure events and do not include failures resulting from misuse or overstress.

Table 3-1 Die Failure Modes and Distribution
Die Failure Modes Failure Mode Distribution (%)
Output open (Hi-Z) 10%
Output short to RGx or RINx 30%
Output short to GND/SUB 30%
Output functional, not in specification voltage or timing 30%