SFFSA16 Functional safety information

Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground

Pin Name	Pin No.	Description of Potential Failure Effects	Failure Effect Class
SH+	1	A short from the bus supply to GND occurs. High current flows from bus supply to GND. Bond wires of pins IN+ and SH+ and die metal trace between pins IN+ and SH+ are damaged.	A
IN+	2	In high-side configuration, a short from the bus supply to GND occurs resulting in high current flow. In low-side configuration, input pins are shorted.	B
A1	3	A1 shorted to GND. No change if initially grounded. Loss of I2C communication if tied to SDA or SCL. Power supply shorted to GND if tied to VS.	D for A1 = GND
A1	3		B otherwise
A0	4	A0 shorted to GND. No change if initially grounded. Loss of I2C communication if tied to SDA or SCL. Power supply shorted to GND if tied to VS.	D for A1=GND
A0	4		B otherwise
SDA	5	SDA shorted to GND. Loss of communication.	B
SCL	6	SCL shorted to GND. Loss of communication.	B
IS-	7	In high-side configuration, a short from the bus supply to GND occurs. High current flows from bus supply to GND. The shunt could be damaged due to high current.	A for high-side
IS-	7	In low-side configuration, normal operation.	D for low-side
SH-	8	In high-side configuration, a short from the bus supply to GND occurs. High current flows from bus supply to GND. Shunt bond wires of pin SH- and die metal trace between pin IN- and SH- can be damaged.	A for high-side
SH-	8	In low-side configuration, normal operation.	D for low-side
IN-	9	In high-side configuration, a short from the bus supply to GND occurs resulting in high current flow.	B for high-side;
IN-	9	In low-side configuration, normal operation.	D for low-side
ALERT	10	ALERT forced to active mode. Loss of ALERT functionality.	B
VS	11	Power supply shorted to GND. No power to the device.	B
GND	12	Normal operation.	D
VBUS	13	VBUS shorted to GND. High current flows from bus supply to GND.	B
IS+	14	A short from the bus supply to GND occurs. High current flows from bus supply to GND. This affects the system functionality but does not affect the IC.	C

Table 4-3 Pin FMA for Device Pins Open-Circuited

Pin Name	Pin No.	Description of Potential Failure Effects	Failure Effect Class
SH+	1	Shunt resistor is not connected to amplifier. IN+ pin floats to an unknown value. Output goes to an unknown value not to exceed VS or GND.	C
IN+	2	Cannot measure sense voltage.	B
A1	3	A1 pin is open. Undefined device address.	B
A0	4	A0 pin is open. Undefined device address.	B
SDA	5	SDA pin is open. Loss of communication.	B
SCL	6	SCL pin is open. Loss of communication.	B
IS-	7	Bus supply to load path is cut off and no load current flows. IN- is at the same potential as bus supply. Differential input voltage is 0V.	C
SH-	8	Shunt resistor is not connected to amplifier. IN- pin floats to an unknown value. Output goes to an unknown value not to exceed VS or GND.	C
IN-	9	Cannot measure sense voltage.	B
ALERT	10	ALERT pin is open. Loss of ALERT functionality.	B
VS	11	No power to the device.	B
GND	12	No power to the device.	B
VBUS	13	VBUS pin floats to an unknown voltage. Any measurements and calculations that depend on VBUS are invalid.	B
IS+	14	Bus supply to load path is cut off and no load current flows. IN+ is at the same potential as GND. Differential input voltage is 0V.	C

Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin

Pin Name	Pin No.	Shorted to	Description of Potential Failure Effects	Failure Effect Class
SH+	1	2 - IN+	Normal operation.	D
IN+	2	3 - A1	IN+ shorted to A1. No change in low-side configuration. Loss of I2C communication unless A1=GND. Damage possible in high-side configuration.	A for high-side
IN+	2	3 - A1		B for low-side
A1	3	4 - A0	A1 shorted to A0. No change if A1 and A0 are initially the same. Loss of I2C communication for any short combination between GND, SDA, SCL, or if SCL is tied to VS. Power supply shorted to ground if one pin is Vs and the other is GND. If SDA is shorted to VS, then the device can be damaged when SDA is driven low by the device if input current is > 10mA.	A for SDA to VS
				D for A1 = A0
				B otherwise
A0	4	5 - SDA	A0 shorted to SDA. Normal operation if A0 = SDA by design.	D if A0 to SDA
A0	4	5 - SDA	A0 shorted to SDA. Normal operation if A0 = SDA by design.	B otherwise
SDA	5	6 - SCL	SDA shorted to SCL. Loss of communication.	B
SCL	6	7 - IS-	SCL shorted to IS-. Loss of I2C communication. Damage is possible in high-side configuration.	A for high-side
SCL	6	7 - IS-		B for low-side
IS-	7	8 - SH-	IS- shorted to SH-. Measurement accuracy is degraded. There is no effect on the IC.	C
SH-	8	9 - IN-	Normal operation.	D
IN-	9	10 - ALERT	IN- shorted to ALERT. In high-side configuration, when ALERT is driven low, device can be damaged.	A for high-side
IN-	9	10 - ALERT	In low-side configuration, loss of functionality.	B for low-side
ALERT	10	11 - VS	ALERT shorted to VS. When ALERT is driven low, device can be damaged.	A
VS	11	11 - GND	Power supply shorted to GND. No power to the device.	B
GND	12	12 - VBUS	VBUS shorted to GND. High current flows from bus supply to GND.	B
VBUS	13	14 - IS+	VBUS shorted to IS+. In high-side configuration, normal operation.	D for high-side
VBUS	13	14 - IS+	In low-side configuration, VBUS is shorted to GND, resulting in loss of some functionality.	B for low-side
IS+	14	1 - SH+	IS+ shorted to SH+. Measurement accuracy is degraded. There is no effect on the IC.	C

Table 4-5 Pin FMA for Device Pins Short-Circuited to VS

Pin Name	Pin No.	Description of Potential Failure Effects	Failure Effect Class
SH+	1	A short from the bus supply to VS occurs High current flows from bus supply to VS or VS to bus supply. Die metal trace between pin IN+ and SH+ is damaged.	A
IN+	2	In high-side configuration, VBUS shorted to VS. The device could be damaged if VS is driven to a voltage > 6V.	A for high-side
IN+	2	In low-side configuration, power supply to short to GND. No power to the device.	B for low-side
A1	3	A1 shorted to VS. No change if initially set to VS. Loss of I2C communication if SCL is tied to VS. Power supply shorted to ground if A1 is GND. If A1 is SDA then the device can be damaged when SDA is driven low by the device if input current is > 10mA.	A for A1 = SDA
			D for A1 = VS
			B otherwise
A0	4	A0 shorted to VS. No change if initially set to VS. Loss of I2C communication if SCL is tied to VS. Power supply shorted to ground if A1 is GND. If A1 is SDA then the device can be damaged when SDA is driven low by the device if input current is > 10mA.	A for A0 = SDA
			D for A0 = VS
			B otherwise
SDA	5	SDA shorted to VS. When SDA is driven low, device can be damaged if input current is > 10mA.	A
SCL	6	SCL shorted to VS. Loss of communication.	B
IS-	7	In high-side configuration, a short from the bus supply to VS occurs. High current flows from bus supply to VS or VS to bus supply. The shunt can be damaged due to high current.	A for high-side
IS-	7	In low-side configuration, system functionality is affected negatively but not the IC.	C for low-side
SH-	8	A short from the bus supply to VS occurs. High current flows from bus supply to VS or VS to bus supply. The shunt and die metal trace between pin IN- and SH- is damaged.	A
IN-	9	In high-side configuration, VBUS shorted to VS. The device can be damaged if VS is driven to a voltage > 6 V.	A for high-side
IN-	9	In low-side configuration, power supply to short to GND. No power to the device.	B for low-side
ALERT	10	ALERT shorted to VS. When ALERT is driven low, device can be damaged if input current is > 10mA.	A
VS	11	Normal operation.	D
GND	12	Power supply shorted to GND. No power to the device.	B
VBUS	13	VBUS shorted to VS. The device can be damaged if VS is driven to a voltage > 6V.	A
IS+	14	In low-side configuration, a short from VS to GND occurs. The shunt can be damaged due to high current.	A for low-side
IS+	14	In high-side configuration, bus supply is shorted to VS and system functionality is affected negatively but not the IC.	C for high-side

4.1 3x5 QFN Package