SLLA535 December   2022 TLIN1431-Q1

 

  1. 1Introduction
    1.     Trademarks
  2. 2TLIN1431x-Q1 Hardware Component Functional Safety Capability
  3. 3Development Process for Management of Systematic Faults
    1. 3.1 TI New-Product Development Process
    2. 3.2 TI Functional Safety Development Process
  4. 4TLIN1431x-Q1 Component Overview
    1. 4.1 Targeted Applications
    2. 4.2 Hardware Component Functional Safety Concept
    3. 4.3 Functional Safety Constraints and Assumptions
  5. 5Description of Hardware Component Parts
    1. 5.1 LIN Transceiver
    2. 5.2 Digital Core
    3. 5.3 Power Control IP
    4. 5.4 Digital Input/Output Pins and High-side Switch
  6. 6TLIN1431x-Q1 Management of Random Faults
    1. 6.1 Fault Reporting
    2. 6.2 Functional Safety Mechanism Categories
    3. 6.3 Description of Functional Safety Mechanisms
      1. 6.3.1 LIN Bus and Communication
        1. 6.3.1.1 SM-1: LIN TXD Pin Dominant State Timeout
        2. 6.3.1.2 SM-2: LIN Bus Stuck Dominant System Fault: False Wake Up Lockout
        3. 6.3.1.3 SM-3: LIN Bus Short Circuit Limiter
        4. 6.3.1.4 SM-20: LIN Internal pull-up to VSUP
        5. 6.3.1.5 SM-22: LIN Protocol
      2. 6.3.2 Voltage Rail Monitoring
        1. 6.3.2.1 SM-4: VCC and Transceiver Thermal Shutdown
        2. 6.3.2.2 SM-5: VCC Under-voltage
        3. 6.3.2.3 SM-6: VCC Over-voltage
        4. 6.3.2.4 SM-7: VCC Short to Ground
        5. 6.3.2.5 SM-8: VSUP Under-voltage
      3. 6.3.3 Processor Communication
        1. 6.3.3.1 SM-9 and SM-10: Watchdog
          1. 6.3.3.1.1 SM-9: Standby Mode Long Window Timeout Watchdog
          2. 6.3.3.1.2 SM-10: Normal Mode Watchdog
        2. 6.3.3.2 SM-11: SPI CRC
        3. 6.3.3.3 SM-12: SPI Communication Error; SPIERR
        4. 6.3.3.4 SM-13: Scratchpad Write/Read Register
        5. 6.3.3.5 SM-14: Sleep Wake Error Timer; tINACT_FS
      4. 6.3.4 Digital Input/Output Pins and High-side Switch
        1. 6.3.4.1 SM-15: CLK internal pull-up to VINT
        2. 6.3.4.2 SM-16: SDI internal pull-up to VINT
        3. 6.3.4.3 SM-17: nCS Internal pull-up to VINT
        4. 6.3.4.4 SM-18: DIV_ON Internal pull-down to GND
        5. 6.3.4.5 SM-19: TXD Internal pull-up to VINT
        6. 6.3.4.6 SM-21: nRST Internal pull-up to VINT
        7. 6.3.4.7 SM-23: HSS Over Current Detect
        8. 6.3.4.8 SM-24: HSS Open Load Detect
          1.        A Summary of Recommended Functional Safety Mechanism Usage
            1.         B Distributed Developments
              1.          B.1 How the Functional Safety Lifecycle Applies to TI Functional Safety Products
              2.          B.2 Activities Performed by Texas Instruments
              3.          B.3 Information Provided
                1.           C Revision History

6.3.1 LIN Bus and Communication

This high voltage input or output pin is a single wire LIN bus transmitter and receiver. The LIN pin can survive transient voltages up to 58 V. Reverse currents from the LIN to supply (VSUP) are minimized with blocking diodes, even in the event of a ground shift or loss of supply (VSUP). There is an internal pull-up resistor with a serial diode structure to VSUP, so no external pull-up components are required for the LIN responder node applications. An external pull-up resistor (1 kΩ) and a series diode to VSUP must be added when the device is used for commander node applications as per the LIN specification (ISO 17987-4).

The transmitter meets thresholds and AC parameters according to the LIN specification. The transmitter is a low side transistor with internal current limitation and thermal shutdown. During a thermal shutdown condition, the transmitter is disabled to protect the device. In fast mode the transmitter can support 200 kbps data rates.

The receiver’s characteristic thresholds are ratiometric with the device supply pin according to the LIN specification. The receiver is capable of receiving higher data rates (>100 kbps) than supported by LIN or SAEJ2602 specifications. This allows the TLIN1431x-Q1 to be used for high speed downloads at the end-of-line production or other applications. The actual data rate achievable depends on system time constants (bus capacitance and pull-up resistance) and driver characteristics used in the system. In fast mode the transmitter and receiver can support 200 kbps.