SLLA543 January 2021 THVD2410 , THVD2450

2 Functional Safety Failure In Time (FIT) Rates

This section provides Functional Safety Failure In Time (FIT) rates for THVD2450 and THVD2410 based on two different industry-wide used reliability standards:

Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
Table 2-3 provides FIT rates based on the Siemens Norm SN 29500-2

Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 for THVD2450

FIT IEC TR 62380 / ISO 26262	FIT (Failures Per 10⁹ Hours) 8-pin SOIC (D)	FIT (Failures Per 10⁹ Hours) 8-pin VSON (DRB)	FIT (Failures Per 10⁹ Hours) 8-pin VSSOP (DGK)
Total Component FIT Rate	11	18	7
Die FIT Rate	3	3	3
Package FIT Rate	8	15	4

Table 2-2 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 for THVD2410

FIT IEC TR 62380 / ISO 26262	FIT (Failures Per 10⁹ Hours) 8-pin SOIC (D)	FIT (Failures Per 10⁹ Hours) 8-pin VSON (DRB)	FIT (Failures Per 10⁹ Hours) 8-pin VSSOP (DGK)
Total Component FIT Rate	10	18	7
Die FIT Rate	3	3	3
Package FIT Rate	7	15	4

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

Mission Profile: Motor Control from Table 11
Power dissipation: 370 mW
Climate type: World-wide Table 8
Package factor (lambda 3): Table 17b
Substrate Material: FR4
EOS FIT rate assumed: 0 FIT

Table 2-3 Component Failure Rates per Siemens Norm SN 29500-2

Table	Category	Reference FIT Rate	Reference Virtual T_J
5	CMOS, BICMOS Digital, analog / mixed	25 FIT	55°C

The Reference FIT Rate and Reference Virtual T_J (junction temperature) in Table 2-3 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.