SLLK031 March   2024 THVD2452V-EP

PRODUCTION DATA  

  1.   1
  2.   Abstract
  3.   Trademarks
  4.   Qualification by Similarity (Qualification Family)

Qualification by Similarity (Qualification Family)

A new device can be qualified either by performing full scale quality and reliability tests on the actual device or using previously qualified device(s) through "Qualification by Similarity" (QBS) rules. By establishing similarity between the new device and those qualified previously, repetitive tests will be eliminated, allowing for timely production release. When adopting QBS methodology, the emphasis is on qualifying the differences between a previously qualified product and the new product under consideration. The QBS rules for a technology, product, test parameters or package shall define which attributes are required to remain fixed in order for the QBS rules to apply. The attributes which are expected and allowed to vary will be reviewed and a QBS plan shall be developed, based on the reliability impact assessment above, specifying what subset of the full complement of environmental stresses is required to evaluate the reliability impact of those variations. Each new device shall be reviewed for conformance to the QBS rule sets applicable to that device. See JEDEC JESD47 for more information.

Enhanced Products New Device Qualification Matrix (Note that qualification by similarity ("qualification family") per JEDEC JESD47 is allowed)
DescriptionConditionSample Size (Allowed Rejects)Lots RequiredTest Method
ElectromigrationMaximum Recommended Operating ConditionsN/AN/APer TI Design Rules
Wire Bond LifeMaximum Recommended Operating ConditionsN/AN/APer TI Design Rules
Electrical CharacterizationTI Data Sheet103N/A
Electrostatic Discharge SensitivityHBM3 units/voltageN/AEIA/JESD22-A114
or
ANSI/ESDA/JEDEC JS-001
CDMEIA/JESD22-C101
or
ANSI/ESDA/JEDEC JS-002
Latch-upPer Technology3(0)1EIA/JESD78
Physical DimensionsTI Data Sheet5(0)1EIA/JESD22- B100
Thermal ImpedanceTheta-JA on boardPer Pin-PackageN/AEIA/JESD51
Bias Life Test125°C / 1000 hours or equivalent45(0)3JESD22-A108(1)
Biased Humidity85°C / 85% / 1000 hours77(0)3JESD22-A101(1)
or
Biased HAST130°C / 85% / 96 hours or 110°C / 85% / 264 hoursJESD22-A110(1)
Extended Biased Humidity(2)85°C/85%/2600 hours 77(-)1JESD22-A101(1)
or
Extended Biased HAST(2)130°C / 85% / 250 hours or 110°C / 85% / 687 hoursJESD22-A110(1)
Unbiased HAST130°C / 85% / 96 hours or 110°C / 85% / 264 hours77(0)3JESD22-A.118(1)
Temperature Cycle-65°C to +150°C non-biased for 500 cycles77(0)3JESD22-A104(1)
Solder Heat260°C for 10 seconds22(0)1JESD22-B106
Resistance to SolventsInk symbol only12(0)1JESD22-B107
SolderabilityBake Preconditioning22(0)1ANSI/J-STD-002
FlammabilityMethod A / Method B5(0)1UL94
Bond ShearPer wire size5 units x 30(0) bonds3JESD22-B116
Bond Pull StrengthPer wire size5 units x 30(0) bonds 3ASTM F-459 or TM2011
Die ShearPer die size5(0)3TM 2019
High Temperature Storage 150°C / 1000 hours15(0)3JESD22-A103(1)
Moisture Sensitivity Surface Mount Only121J-STD-020(1)
Precondition performed per JEDEC Std. 22, Method A112/A113.
For information only.
Technology Family FIT / MTBF Data
Mean Time Between Fails (MTBF) and Failures in Time (FIT) rates are device reliability statistics calculated based on data collected from TI’s internal reliability testing (life test).

TI’s DPPM/FIT/MTBF Estimator Search Tool reports the generic data based on technology groupings and shows conditions under which the rates were derived. All terms used in the tool and definitions can be found on the TI reliability terminology page. Failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested, therefore, it is not recommended to compare failure rates.

TI DPPM/FIT/MTBF Estimator Search Tool webpage link:

www.ti.com/quality/docs/estimator.tsp

Device Family Qualification Data

TI’s Qualification Summary Search Tool reports generic qualification data representative of the material sets, processes, and manufacturing sites used by the device family and may not include all of the testing performed for a specific EP device. Please see the Enhanced Products New Device Qualification Matrix above for the full suite of qualification testing performed to release Enhanced Product devices.

TI Qualification Summary Search webpage link:

www.ti.com/qualificationsummary/qualsumm/home

Ongoing Reliability Monitoring

TI periodically monitors the reliability of its products, wafer fab processes, and package technologies, through its Ongoing Reliability Monitor (ORM) program. The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.

TI Ongoing Reliability Monitoring Search webpage link:

www.ti.com/orm/home?actionId=2801.html

For additional information or technical support please contact the Texas Instruments Customer Support Center at www.ti.com/csc For more information on TI Enhanced Products please visit www.ti.com/ep