SLLU229 May   2022 TUSB2E11

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2EVM Quick Setup Instructions
  5. 3EVM Configuration Using Jumpers
    1. 3.1 Default EVM Configuration
    2. 3.2 EVM Power Configuration
      1. 3.2.1 Power Options
      2. 3.2.2 Host Mode
      3. 3.2.3 Device Mode – Self Powered
      4. 3.2.4 Device Mode – Bus Powered
    3. 3.3 TUSB2E11 Functional Modes
      1. 3.3.1 I2C Mode
      2. 3.3.2 GPIO Mode
      3. 3.3.3 UART Mode
  6. 4TUSB2E11EVM Internal Lab Use Only
  7. 5Layout Notes
  8. 6Schematic
  9. 7Bill of Materials

5 Layout Notes

The TUSB2E11EVM was laid out with the following considerations:

  • USB signals impedance controlled 90 Ω differential ± 5%
  • eUSB signals impedance controlled 45 Ω signal ended ± 5%
  • USB 2.0 and eUSB signal pairs routed with matched trace lengths and minimal vias.
  • All other signals to be impedance controlled 45 Ω ± 10% or 50 Ω ± 10%

General information about the PCB is provided below:

  • Finished board thickness: .062 ± 10% – necessary for socket
  • Copper weight: 1 oz start internal, 1/2 oz start external
  • Laminate material: FR4 Polyclad 370 or equivalent

A four layer stack-up was used for the TUSB2E11EVM.

Drill notes on board stack up to account for the small BGA breakout:

  1. L1 – L2 (laser drill) used for small pitch BGA break out
  2. L2 – L3 (mechanical drill) completes the small pitch BGA breakout
  3. L3 – L4 (laser drill) for VPP