SLUUC74 May   2021 BQ25720 , BQ25723

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 EVM Features
    2. 1.2 General Description
  3. 2Test Summary
    1. 2.1 Definitions
    2. 2.2 Equipment
    3. 2.3 Equipment Setup
    4. 2.4 Procedure
      1. 2.4.1 Charge Function
      2. 2.4.2 OTG Function
  4. 3Bill of Materials, Board Layout, and Schematics
    1. 3.1 Bill of Materials
    2. 3.2 Board Assembly Layout
    3. 3.3 Schematic

Board Assembly Layout

Figure 3-1 through Figure 3-6 illustrate the board assembly and layout images.

GUID-20210510-CA0I-B7FG-RSWR-W2P4FX8ZWTBT-low.pngFigure 3-1 Top Assembly
GUID-20210112-CA0I-N9P6-GQB8-K6305WD99WWG-low.pngFigure 3-2 Bottom Assembly
GUID-20210112-CA0I-CTP3-H1RN-JCLXSHNDLKCJ-low.pngFigure 3-3 PCB Layer 1
GUID-20210112-CA0I-7RHG-JJWX-Q4DM0BZMM3Q7-low.pngFigure 3-4 PCB Layer 2
GUID-20210112-CA0I-KVFJ-NMSK-NFRVPZF6NGFQ-low.pngFigure 3-5 PCB Layer 3
GUID-20210112-CA0I-GWNM-3QQH-N25JQKVQCCSH-low.pngFigure 3-6 PCB Layer 4