SLUUCX1 august   2023 BQ25173-Q1

1.   1
2.   Description
3.   Features
4.   Applications
5.   5
6. 1Evaluation Module Overview
   1. 1.1 Introduction
   2. 1.2 Kit Contents
   3. 1.3 Specification
   4. 1.4 Device Information
7. 2Hardware
   1. 2.1 I/O Descriptions
   2. 2.2 Printed Circuit Board Assembly
   3. 2.3 Best Practices
      1.      15
   4. 2.4 Test Summary
      1. 2.4.1 Equipment
      2. 2.4.2 Cautions
      3. 2.4.3 Test Instructions
8. 3Hardware Design Files
   1. 3.1 Schematic
   2. 3.2 Board Layout
   3. 3.3 Bill of Materials
9. 4Additional Information
   1.     Trademarks