SLUUD53 September   2024 TPS51388

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Test Setup and Procedure
      1. 2.1.1 EVM Connections
      2. 2.1.2 Test Equipment
      3. 2.1.3 Recommended Test Setup
        1. 2.1.3.1 Input Connections
        2. 2.1.3.2 Output connections
      4. 2.1.4 Test Procedure
        1. 2.1.4.1 Line and Load Regulation, Efficiency
  8. 3Implementation Results
    1. 3.1 Performance Data and Results
      1. 3.1.1 EVM Characteristics
      2. 3.1.2 Conversion Efficiency
      3. 3.1.3 Operating Waveforms
        1. 3.1.3.1 Start-Up and Shutdown with EN
        2. 3.1.3.2 Start-Up with VIN
        3. 3.1.3.3 Load Transient Response
        4. 3.1.3.4 Output Voltage Ripple
      4. 3.1.4 Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
      1. 4.2.1 Multi-Layer Stackup
      2. 4.2.2 Component Drawings
    3. 4.3 Bill of Materials
  10. 5Compliance Information
    1. 5.1 Compliance and Certifications
  11. 6Additional Information
    1. 6.1 Trademarks
  12. 7Related Documentation

PCB Layout

The design of the TPS51388EVM using a four-layer PCB with 2-oz copper thickness is shown in Figure 4-2 through Figure 4-5.

TPS51388EVM Top
                                                  Copper (Top View)Figure 4-2 Top Copper (Top View)
TPS51388EVM Layer 3 Copper (Top View)Figure 4-4 Layer 3 Copper (Top View)
TPS51388EVM Layer 2 Copper (Top View)Figure 4-3 Layer 2 Copper (Top View)
TPS51388EVM Bottom Copper (Top View)Figure 4-5 Bottom Copper (Top View)