SLVA888C April   2017  – January 2021 TPS65987D , TPS65988

 

  1.   Trademarks
  2. 1Schematic Design Guidelines
    1. 1.1  Power Supply Scheme
      1. 1.1.1 VIN_3V3
      2. 1.1.2 LDO_3V3
      3. 1.1.3 LDO_1V8
    2. 1.2  Boot Configuration
      1. 1.2.1 BUSPOWER (ADCIN1)
      2. 1.2.2 External SPI Flash
    3. 1.3  I2C Interface
      1. 1.3.1 I2C Pin Address Setting (ADCIN2)
    4. 1.4  HRESET
    5. 1.5  Configuration Channel / VCONN Lines
      1. 1.5.1 PP_CABLE
    6. 1.6  Battery Charger Detection and Advertisement (BC1.2)
    7. 1.7  GPIOs
    8. 1.8  Hot Plug Detect or HPD Line
    9. 1.9  PP_EXT Power Path Control
    10. 1.10 Power Path Considerations
  3. 2Layout Guidelines
    1. 2.1 Power Domain
    2. 2.2 Hi Speed Lines
    3. 2.3 Other Considerations
  4. 3Summary
  5. 4References
  6.   A Appendix
    1.     A.1 Dead Battery Considerations
    2.     A.2 TPS65987DDH Schematic Checklist
    3.     A.3 TPS65987DDH System Checklist
  7.   Revision History

Hi Speed Lines

In a USB PD system, hi speed signals can reach up to 10 Gbit/s. In a Thunderbolt 3 based system, the data rate can rise to 40 Gbit/s. At high data rates, signal integrity may not be maintained. Use these guidelines to avoid signal quality issues.

  1. Ensure SuperSpeed or Alternate Mode multiplexers are placed close to the Type-C receptacle. This is required to avoid signal quality issues as the high speed lines can directly be routed to the multiplexer.
    GUID-6CCF18DA-408D-42D9-8519-F951940DB946-low.pngFigure 2-1 High Speed Signal Routing Example
  2. Do not place switching circuits close to the multiplexer and the high speed signal traces to avoid noise coupling in these signals.
  3. Maintain 90-Ω differential impedance for high speed signals.
  4. Two differential pairs must be separated by at least three times the width of the differential pair and should be uniformly laid out.
  5. Intra Pair length of the differential pair traces should be matched within 5 mills.
  6. Avoid bents on high speed signals. If required, then use curved bents or 45° bents. Never use 90° bent.
    GUID-85792A17-53B5-4E2E-85F1-367BC4C71EE5-low.png Figure 2-2 Recommended Signal Bents
  7. If two pairs of high speed signals cross each other on two planes, then there must be a ground plane between these two planes.
  8. Maintain continuous grounding while changing the layer of high speed signal to ensure uniform impedance. When placing a via on a high speed signal, place GND vias next to them to maintain uniform impedance.