SLVAEK8B December 2019 – November 2024 LP2951-Q1

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the LP2951-Q1 (WSON-8 and SOIC-8 packages). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Pin short-circuited to ground (see Table 4-6 and Table 4-6)
Pin open-circuited (see Table 4-7 and Table 4-7)
Pin short-circuited to an adjacent pin (see Table 4-8 and Table 4-8)
Pin short-circuited to input (see Table 4-9 and Table 4-9)

Table 4-6 through Table 4-9 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects

Class	Failure Effects
A	Potential device damage that affects functionality.
B	No device damage, but loss of functionality.
C	No device damage, but performance degradation.
D	No device damage, no impact to functionality or performance.

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

Device must maintain the same pin configuration as with the WSON-8 and SOIC-8 packages.
Device operates with an input voltage less than 30V and an output current less than 100mA.
Device operates across virtual junction temperatures ranging from -40°C to 125°C.
Device operates according to the recommended operating conditions and does not exceed the absolute maximum ratings.