SLVSER3A November   2018  – April 2020 TPS65982BB

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Characteristics
    6. 6.6  Power Supervisor Characteristics
    7. 6.7  Power Consumption Characteristics
    8. 6.8  Port-Power Switch Characteristics
    9. 6.9  Port-Data Multiplexer Characteristics
    10. 6.10 Port-Data Multiplexer Clamp Characteristics
    11. 6.11 Port-Data Multiplexer Signal Monitoring Pullup and Pulldown Characteristics
    12. 6.12 USB Endpoint Characteristics
    13. 6.13 Input/Output (I/O) Characteristics
    14. 6.14 I2C Slave Characteristics
    15. 6.15 Thermal Shutdown Characteristics
    16. 6.16 Oscillator Characteristics
    17. 6.17 SPI Master Switching Characteristics
    18. 6.18 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Port-Power Switches
        1. 8.3.1.1 5-V Power Delivery
        2. 8.3.1.2 5-V Power Switch
        3. 8.3.1.3 PP_5V0 Current Limit
        4. 8.3.1.4 VBUS Transition to VSAFE0V
      2. 8.3.2  USB Port-Data Multiplexer
        1. 8.3.2.1 Port Multiplexer Clamp
        2. 8.3.2.2 USB2.0 Low-Speed Endpoint
      3. 8.3.3  Power Management
        1. 8.3.3.1 Power-On and Supervisory Functions
      4. 8.3.4  Digital Core
      5. 8.3.5  Power Reset-Control Module (PRCM)
      6. 8.3.6  Interrupt Monitor
      7. 8.3.7  I2C Slave
      8. 8.3.8  SPI Master
      9. 8.3.9  Thermal Shutdown
      10. 8.3.10 Oscillators
    4. 8.4 Device Functional Modes
      1. 8.4.1 SPI Master Interface
      2. 8.4.2 I2C Slave Interface
        1. 8.4.2.1 I2C Interface Description
        2. 8.4.2.2 I2C Clock Stretching
        3. 8.4.2.3 I2C Address Setting
        4. 8.4.2.4 Unique-Address Interface
        5. 8.4.2.5 I2C Pin Address Setting
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 VBUS Load Switch
      2. 9.2.2 HRESET
      3. 9.2.3 Dual Port Billboard Support
  10. 10Power Supply Recommendations
    1. 10.1 3.3-V Power
      1. 10.1.1 1VIN_3V3 Input Switch
      2. 10.1.2 VOUT_3V3 Output Switch
    2. 10.2 1.8-V Core Power
      1. 10.2.1 1.8-V Digital LDO
      2. 10.2.2 1.8-V Analog LDO
    3. 10.3 VDDIO
      1. 10.3.1 Recommended Supply Load Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Component Placement
      2. 11.2.2 Recommended Via Size and Trace Widths
      3. 11.2.3 USB2 Routing
      4. 11.2.4 Oval Pad for BGA Fanout
      5. 11.2.5 Top and Bottom Layer Complete Routing
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

6.5 Power Supply Characteristics

Recommended operating conditions; TA = –10 to +85°C unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
EXTERNAL
VIN_3V3 Input 3.3-V supply 2.85 3.3 3.45 V
VBUS Output DC bus voltage. 4 5 5.5 V
PP_5V0 5-V supply input to power VBUS. This supply does not power the TPS65982BB 4.75 5 5.5 V
VDDIO(1) Optional supply for I/O cells 1.7 3.45 V
INTERNAL
VLDO_3V3 DC 3.3 V generated internally by either a switch from VIN_3V3, an LDO from PP_CABLE, or an LDO from VBUS 2.7 3.3 3.45 V
VLDO_1V8D DC 1.8 V generated for internal digital circuitry 1.7 1.8 1.9 V
VLDO_1V8A DC 1.8 V generated for internal analog circuitry 1.7 1.8 1.9 V
VLDO_BMC DC voltage generated on LDO_BMC. Setting for USB-PD. 1.05 1.125 1.2 V
IOUT_3V3 External DC current supplied by VOUT_3V3 100 mA
ILDO_1V8D DC current supplied by LDO_1V8D. This is intended for internal loads only but small external loads may be added 50 mA
ILDO_1V8DEX External DC current supplied by LDO_1V8D 5 mA
ILDO_1V8A DC current supplied by LDO_1V8A. This is intended for internal loads only but small external loads may be added 20 mA
ILDO_1V8AEX External DC current supplied by LDO_1V8A 5 mA
ILDO_BMC DC current supplied by LDO_BMC. This is intended for internal loads only 5 mA
ILDO_BMCEX External DC current supplied by LDO_BMC 0 mA
VFWD_DROP Forward voltage drop across VIN_3V3 to LDO_3V3 switch ILOAD = 50 mA 25 60 90 mV
RIN_3V3 Input switch resistance from VIN_3V3 to LDO_3V3 VVIN_3V3 – VLDO_3V3 > 50 mV 0.5 1.1 1.75 Ω
ROUT_3V3 Output switch resistance from VIN_3V3 to VOUT_3V3 0.35 0.7 Ω
TR_OUT3V3 10-90% rise time on VOUT_3V3 from switch enable CVOUT_3V3 = 1 μF 35 120 µs
(1) I/O buffers are not fail-safe to LDO_3V3. Therefore, VDDIO may power-up before LDO_3V3. When VDDIO powers up before LDO_3V3, the I/Os shall not be driven high. When VDDIO is low and LDO_3V3 is high, the I/Os may be driven high.