SLVUBU9A April   2020  – September 2020 TPS63900

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Background
    2. 1.2 Performance Specification
    3. 1.3 Modifications
  3. 2Setup
    1. 2.1 Input/Output Connector and Header Descriptions
      1. 2.1.1  J1, Pin 1 and 2 – VIN
      2. 2.1.2  J1, Pin 3 and 4 – S+/S-
      3. 2.1.3  J1, Pin 5 and 6 – GND
      4. 2.1.4  J2, Pin 1 and 2 – VOUT
      5. 2.1.5  J2, Pin 3 and 4 – S+/S-
      6. 2.1.6  J2, Pin 5 and 6 – GND
      7. 2.1.7  J4 – GND
      8. 2.1.8  JP1 – SEL
      9. 2.1.9  JP2 – ENABLE
      10. 2.1.10 JP3 – CFG1
      11. 2.1.11 JP4 – CFG2
      12. 2.1.12 JP5 – CFG3
      13. 2.1.13 S1, S2, S3, S4, S5, S6 – IC Configuration (R2D Interface)
    2. 2.2 Setup
  4. 3Board Layout
    1. 3.1 Layout
  5. 4Schematic
  6. 5Bill of Materials
  7.   Revision History

1.3 Modifications

The printed-circuit board (PCB) for this EVM is designed to accommodate the TPS63900. Extra positions are available for additional input and output capacitors.