Table 2-1
lists the EVM specifications. VVDD = 12 V, unless otherwise noted.
Table 1-1 Electrical Performance
SpecificationsPARAMETER | CONDITIONS | MIN | TYP | MAX | UNIT |
---|
INPUT
CHARACTERISTICS |
VDD supply voltage, VVDD(1) | | 8 | 12 | 16 | V |
VDD UVLO turn-on threshold, VVDD(on) | VVDD rising | | 7.7 | |
VDD UVLO turn-off threshold, VVDD(off) | VVDD falling | | 6.7 | |
VDD supply current, enabled, IVDD(on) | EN open or tied high | | 12.5 | | mA |
VDD supply current, disabled, IVDD(off) | EN tied to GND | | 50 | | µA |
OUTPUT
CHARACTERISTICS |
Inject voltage, VINJ(2) | | 2.5 | | VVDD – 2 | V |
Inject current, IINJ | VVDD = 8 V to 16 V | –80 | | 80 | mA |
SYSTEM
CHARACTERISTICS |
Common-mode EMI reduction(3) | 100 kHz to 1 MHz | | 25 | | dB |
IC junction temperature, TJ(4) | | –40 | | 150 | °C |
(1) The nominal supply voltage (relative to chassis GND) of the TPSF12C3 is 12
V.
(2) Verify that the INJ pin voltage swing is between the prescribed limits to avoid
saturation and clipping.
(3) The expected EMI reduction with
this EVM is up to 30 dB (with the device enabled vs. disabled) when swept from
100 kHz to 3 MHz. This performance metric can change based on the VDD supply
voltage, passive filter component values, active circuit compensation and
damping component values, ambient temperature, and other parameters.
(4) Calculate the TPSF12C3 operating junction
temperature based on the VDD supply voltage and current, the local ambient
temperature, and the junction-to-ambient thermal resistance: TJ =
TA + RθJA × PD, where the IC power
dissipation is PD = VVDD × IVDD.