SLVUCR4 December   2023 TPS281C100

 

  1.   1
  2.   Description
  3.   3
  4.   Features
  5.   5
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 BoosterPack Plug-in Module Operation
    2. 2.2 Connection Descriptions
    3. 2.3 Best Practices
  9. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials
  10. 4Additional Information
    1.     Trademarks

PCB Layouts

GUID-20231205-SS0I-21LX-LGCH-3XDRLDF62J0D-low.svg Figure 3-2 3D Representation
GUID-20231205-SS0I-J2BJ-2PDN-3FSCQTGRBXN8-low.svg Figure 3-3 Top Layer
GUID-20231205-SS0I-4SCT-TZFJ-6NG57Q6MJJB5-low.svg Figure 3-4 Ground Layer
GUID-20231205-SS0I-GRS5-FQ4N-PVSNXKCBWJQM-low.svg Figure 3-5 Power Layer
GUID-20231205-SS0I-D5RF-9HW2-NLPTZSQSMDZ9-low.svg Figure 3-6 Bottom Layer