SLVUCY4 June   2024 LM5190-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Test Setup and Procedure
      1. 2.1.1 EVM Connections
      2. 2.1.2 Test Equipment
      3. 2.1.3 Recommended Test Setup
        1. 2.1.3.1 Input Connections
        2. 2.1.3.2 Output Connections
      4. 2.1.4 Test Procedure
        1. 2.1.4.1 Basic Test Procedure
  8. 3Implementation Results
    1. 3.1 Test Data and Performance Curves
      1. 3.1.1 Efficiency
      2. 3.1.2 Operating Waveforms
        1. 3.1.2.1 Start-Up and Shutdown With EN
        2. 3.1.2.2 Switching
        3. 3.1.2.3 Load Transient (CV), ISET Modulation (CC)
      3. 3.1.3 Thermal Performance
      4. 3.1.4 Bode Plot
      5. 3.1.5 EMI Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Device and Documentation Support
    1. 6.1 Device Support
      1. 6.1.1 Development Support
    2. 6.2 Documentation Support
      1. 6.2.1 Related Documentation
        1. 6.2.1.1 PCB Layout Resources
        2. 6.2.1.2 Thermal Design Resources

2.1.1 EVM Connections

The recommended test setup is shown in Figure 3-1. Working at an ESD-protected workstation, make sure that any wrist straps, boot straps, or mats are connected and referencing the user to earth ground before handling the EVM.

LM5190QEVM-400 EVM Test Setup Figure 2-1 EVM Test Setup
CAUTION:
LM5190QEVM-400

Hot surface. Contact can cause burns. Do not touch.
Table 2-1 Power Connections
REF DES LABEL DESCRIPTION
J1 VIN+ Positive input voltage power connection.
J1 VIN– Negative input voltage power connection.
J2 VIN_EMI+ Positive input voltage power connection for EMI test.
J2 VIN_EMI– Negative input voltage power connection for EMI test.
J5 VOUT+ Positive output voltage power connection.
J5 VOUT– Negative output voltage power connection.
Table 2-2 DVM Connections
REF DES LABEL DESCRIPTION
TP1 VIN+ Positive input voltage sensing.
TP2 VIN- Negative input voltage sensing.
TP3 VOUT+ Positive output voltage sensing.
TP4 VOUT- Negative output voltage sensing.
Table 2-3 J8 Jumper
NUMBER LABEL DESCRIPTION
1 VOUT VOUT connection.
2 BIAS BIAS connection. Connect #1 to #2 for the external BIAS supply from VOUT.
3 VCC VCC connection.
4 FB FB connection.
5 COMP COMP connection
6 PG PGOOD connection. An open-collector output is connected to VCC through 100kΩ pull-up resistor.
7 ISET ISET connection. Dynamic current setting pin for the constant current operation.
8 AGND Ground connection.
9 ILIM/IMON IMON connection. Current monitor and current limit programming pin.
10 AGND Ground connection.
11 EN ENABLE input. Connect #10 to #11 to disable the device.
Table 2-4 J3 Jumper
NUMBER LABEL DESCRIPTION
1 AGND Ground connection.
2 FPWM/SYNC FPWM/SYNC connection. Connect #1 to #2 for PFM . Connect #2 to #3 for FPWM. Apply external clock synchronization pulse if required.
3 VCC VCC connection.
Table 2-5 J4 Jumper
NUMBER LABEL DESCRIPTION
1 VCC VCC connection.
2 RT Connection to RT resistor. Connect #1 to #2 during initial start-up for DRSS. Connect #2 to #3 during initial start-up for the fixed switching frequency operation.
3 AGND Ground connection.
Table 2-6 J7 Jumper
NUMBER LABEL DESCRIPTION
1 VCC VCC connection.
2 FB FB connection. Connect #1 to #2 for the 12V fixed output using internal feedback. Connect #2 to #3 for the 5V fixed output using internal feedback.
3 AGND Ground connection.
Table 2-7 J6 Jumper
NUMBER LABEL DESCRIPTION
1 TRIM Apply an external voltage to change the output regulation target dynamically.
2 BODE- 50Ω injection point for CV loop response measurement. Connected to feedback resistor.
3 BODE+ 50Ω injection point for CV loop response measurement. Connected to output capacitor.