SLVUCY4
June 2024
LM5190-Q1
1
Description
Features
Applications
5
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specification
1.4
Device Information
2
Hardware
2.1
Test Setup and Procedure
2.1.1
EVM Connections
2.1.2
Test Equipment
2.1.3
Recommended Test Setup
2.1.3.1
Input Connections
2.1.3.2
Output Connections
2.1.4
Test Procedure
2.1.4.1
Basic Test Procedure
3
Implementation Results
3.1
Test Data and Performance Curves
3.1.1
Efficiency
3.1.2
Operating Waveforms
3.1.2.1
Start-Up and Shutdown With EN
3.1.2.2
Switching
3.1.2.3
Load Transient (CV), ISET Modulation (CC)
3.1.3
Thermal Performance
3.1.4
Bode Plot
3.1.5
EMI Performance
4
Hardware Design Files
4.1
Schematic
4.2
PCB Layout
4.3
Bill of Materials
5
Additional Information
5.1
Trademarks
6
Device and Documentation Support
6.1
Device Support
6.1.1
Development Support
6.2
Documentation Support
6.2.1
Related Documentation
6.2.1.1
PCB Layout Resources
6.2.1.2
Thermal Design Resources
4.2
PCB Layout
LM5190 EVM uses a 6-layer PCB with 2-oz copper thickness.
Figure 4-2
Top Components (Top View)
Figure 4-3
Bottom Components (Bottom View)
Figure 4-4
Top Layer Copper (Top View)
Figure 4-5
Layer 2 Copper (Top View)
Figure 4-6
Layer 3 Copper (Top View)
Figure 4-7
Layer 4 Copper (Top View)
Figure 4-8
Layer 5 Copper (Top View)
Figure 4-9
Bottom Copper (Top View)