SLYT793A may   2020  – may 2020 LM61460-Q1

 

  1.   1
  2. 1 Introduction
  3. 2 Managing Thermals with Flip-chip Packages
  4. 3 Board Construction Influence
  5. 4 Copper Area and Thermals
  6. 5 Estimating a Converter’s Junction Temperature
  7. 6 Challenges with Measuring Converter Junction Temperature
  8. 7 Further Thermal Optimization at the IC Level
  9. 8 Conclusion
  10. 9 References
  11. 10Related Web Sites
    1. 10.1 General Information:
    2. 10.2 Product Information: