SLYT793A may   2020  – may 2020 LM61460-Q1

 

  1.   1
  2. 1 Introduction
  3. 2 Managing Thermals with Flip-chip Packages
  4. 3 Board Construction Influence
  5. 4 Copper Area and Thermals
  6. 5 Estimating a Converter’s Junction Temperature
  7. 6 Challenges with Measuring Converter Junction Temperature
  8. 7 Further Thermal Optimization at the IC Level
  9. 8 Conclusion
  10. 9 References
  11. 10Related Web Sites
    1. 10.1 General Information:
    2. 10.2 Product Information:

8 Conclusion

Following the techniques in this article, a converter design’s thermal performance can be estimated before building the first prototype board. This will enable faster-to-market project builds and avoid thermal issues down the road. In designs where thermal performance is an issue, the techniques outlined in this article can be used to further improve thermal performance and finish the PCB project.